Inventor · disambiguated record
Bongsub Lee
Also filed as: LEE BONGSUB
19 granted patents·7 pending applications·364 citations·filing 2015–2025
94Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC13INVENSAS CORP8INVENSAS BONDING TECH INC4ADEIA SEMICONDUCTOR TECH LLC1
Top patents by PatentIndex Score
26 records- 0198US11955445B2Metal pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·5 cites·23 claims
- 0298US11393779B2Large metal pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 19, 2022·58 cites·15 claims
- 0398US11004757B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted May 11, 2021·117 cites·20 claims
- 0497US11728313B2Offset pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 15, 2023·4 cites·22 claims
- 0597US10998292B2Offset pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted May 4, 2021·155 cites·13 claims
- 0696US12243851B2Offset pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Mar 4, 2025·2 cites·20 claims
- 0796US11955393B2Structures for bonding elements including conductive interface featuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Apr 9, 2024·3 cites·10 claims
- 0895US12205926B2TSV as padADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jan 21, 2025·1 cites·22 claims
- 0995US11749645B2TSV as padADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2019·Granted Sep 5, 2023·8 cites·22 claims
- 1090US2025253294A1Tsv as padADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1185US12482776B2Metal pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Nov 25, 2025·0 cites·13 claims
- 1285US10008469B2Wafer-level packaging using wire bond wires in place of a redistribution layerINVENSAS CORP·Filed 2016·Granted Jun 26, 2018·4 cites·13 claims
- 1381US9847238B2Fan-out wafer-level packaging using metal foil laminationINVENSAS CORP·Filed 2017·Granted Dec 19, 2017·3 cites·12 claims
- 1481US2025300135A1Offset pads over tsvADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 1577US2024249985A1Structures for bonding elements including conductive interface featuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1676US9543277B1Wafer level packages with mechanically decoupled fan-in and fan-out areasINVENSAS CORP·Filed 2015·Granted Jan 10, 2017·3 cites·20 claims
- 1764US9646946B2Fan-out wafer-level packaging using metal foil laminationINVENSAS CORP·Filed 2015·Granted May 9, 2017·1 cites·6 claims
- 1861US2025253206A1Integrated cooling assemblies for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1959US2025273517A1Apparatus and methods for surface inspectionADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2058US12512425B2Expansion controlled structure for direct bonding and method of forming sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 2156US10600761B2Nanoscale interconnect array for stacked diesINVENSAS CORP·Filed 2019·Granted Mar 24, 2020·0 cites·19 claims
- 2256US2025185163A1Organic-to-inorganic bonding methods and structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 2353US2023067677A1Sequences and equipment for direct bondingINVENSAS BONDING TECH INC·Filed 2022·Application pending·0 cites
- 2447US10304803B2Nanoscale interconnect array for stacked diesINVENSAS CORP·Filed 2016·Granted May 28, 2019·0 cites·12 claims
- 2547US9502372B1Wafer-level packaging using wire bond wires in place of a redistribution layerINVENSAS CORP·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims
- 2638US9859234B2Methods and structures to repair device warpageINVENSAS CORP·Filed 2015·Granted Jan 2, 2018·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Bongsub Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →