Inventor · disambiguated record

Boon Pek Liew

Also filed as: LIEW BOON PEK

2 granted patents·33 citations·filing 2005–2017

58Inventor score

Technology areasH10W

Files withCARSEM M SDN BHD1 UTAC HEADQUARTERS PTE LTD1

Top patents by PatentIndex Score

2 records

0186US7273767B2Method of manufacturing a cavity packageCARSEM M SDN BHD·Filed 2005·Granted Sep 25, 2007·31 cites·24 claims
0268US10566369B2Image sensor with processor packageUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Feb 18, 2020·2 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →