Inventor · disambiguated record
Boon Kian Lim
Also filed as: LIM BOON KIAN
3 granted patents·11 citations·filing 2007–2010
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0176US7732937B2Semiconductor package with mold lock ventINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 8, 2010·7 cites·6 claims
- 0260US8466009B2Method of fabricating a semiconductor package with mold lock openingGOLLER BERND·Filed 2010·Granted Jun 18, 2013·2 cites·14 claims
- 0355US8030742B2Electronic device having profiled elements extending from planar surfacesINFINEON TECHNOLOGIES·Filed 2007·Granted Oct 4, 2011·2 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →