Inventor · disambiguated record
Bok Sim Lim
Also filed as: LIM BOK SIM
3 granted patents·1 pending application·2 citations·filing 2008–2014
56Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0155US8258019B2Flip chip assembly process for ultra thin substrate and package on package assemblyMONG WENG KHOON·Filed 2008·Granted Sep 4, 2012·2 cites·9 claims
- 0251US9397016B2Flip chip assembly process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2014·Granted Jul 19, 2016·0 cites·18 claims
- 0342US8847368B2Flip chip assembly process for ultra thin substrate and package on package assemblyMONG WENG KHOON·Filed 2012·Granted Sep 30, 2014·0 cites·16 claims
- 0434US2010120199A1Stacked package-on-package semiconductor device and methods of fabricating thereofLIM BOK SIM·Filed 2008·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bok Sim Lim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →