Inventor · disambiguated record
Bong Sup Lim
Also filed as: LIM BONG SUP
8 granted patents·13 pending applications·33 citations·filing 2002–2018
80Inventor score
Top patents by PatentIndex Score
21 records- 0186US8215484B2Package member for flat panel display apparatusLIM BONG SUP·Filed 2011·Granted Jul 10, 2012·19 cites·19 claims
- 0283US9114897B2Automatic packing apparatus and automatic packing method using the sameKIM JIN HO·Filed 2011·Granted Aug 25, 2015·12 cites·21 claims
- 0366US11129288B2Packing materials for display apparatus and packing method for display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 21, 2021·1 cites·10 claims
- 0452US2007199855A1Multi-layered packaging film, packaging bag, and package and packaging method using the multi-layered packaging film and the packaging bagSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0551US10998119B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted May 4, 2021·0 cites·14 claims
- 0648US9583254B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 28, 2017·0 cites·20 claims
- 0747US2015061810A1Multilayer type inductor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0846US2015287514A1Chip coil component and board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0946US2015187486A1Multilayer electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1045US2015015357A1Multilayer inductorSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1144US10308390B2Corrugated packaging boxSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 4, 2019·0 cites·24 claims
- 1243US9041493B2Coupling structure for multi-layered chip filter, and multi-layered chip filter with the structureAHN YOUNG GHYU·Filed 2011·Granted May 26, 2015·0 cites·10 claims
- 1342US2003038171A1Box openable at a side thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Application pending·0 cites
- 1439US2013063238A1Chip inductorLIM BONG SUP·Filed 2012·Application pending·0 cites
- 1538US2013093556A1Multilayered ceramic electronic component and fabrication method thereofLIM BONG SUP·Filed 2012·Application pending·0 cites
- 1635US2011309895A1Multilayer filterAHN YOUNG GHYU·Filed 2011·Application pending·0 cites
- 1735US2011086216A1Foamed resin product and foamed resin molding machine to manufacture the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 1834US2016126003A1Multilayer inductorSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1933US2016111205A1Chip component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2033US2016012957A1Chip coil componentSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2130USD767990SBoxSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 4, 2016·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →