Inventor · disambiguated record
Bo Liu
Also filed as: LIU BO · Liu bo-wei
4 granted patents·8 pending applications·5 citations·filing 2007–2023
60Inventor score
Top patents by PatentIndex Score
12 records- 0176US9854674B1Flexible printed circuit and printed circuit board soldered structureLUXNET CORP·Filed 2017·Granted Dec 26, 2017·4 cites·12 claims
- 0255US2024181675A1Removal-facilitated anchor sealing device for box girder constructionUNIV YANTAI·Filed 2023·Application pending·0 cites
- 0354US2009291290A1Packaging material and method for making the sameSHENZHEN FUTAIHONG PREC IND CO·Filed 2008·Application pending·0 cites
- 0447US10656362B2Gamma groove arrays for interconnecting and mounting devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted May 19, 2020·0 cites·9 claims
- 0544US12428257B2Adjustable strand threading and lubricating device for prefabricated box girdersUNIV YANTAI·Filed 2023·Granted Sep 30, 2025·0 cites·7 claims
- 0639US2011020639A1Plastic laminate and method for making the plastic laminateSHENZHEN FUTAIHONG PREC IND CO·Filed 2010·Application pending·0 cites
- 0737US7988442B2Vacuum mold and device for drilling extraction holes thereinSHENZHEN FUTAIHONG PREC IND CO·Filed 2008·Granted Aug 2, 2011·1 cites·4 claims
- 0836US2011132789A1Tray for storing and transporting workpiecesSHENZHEN FUTAIHONG PREC IND CO·Filed 2010·Application pending·0 cites
- 0934US2008118732A1Packing laminateSHENZHEN FUTAIHONG PREC IND CO·Filed 2007·Application pending·0 cites
- 1031US2018190520A1Composite heat-dissipating substrateLUXNET CORP·Filed 2017·Application pending·0 cites
- 1131US2018248336A1Assembly of semiconductor and highly thermally conductive heat-dissipating substratesLUXNET CORP·Filed 2018·Application pending·0 cites
- 1230US2018191131A1Heat-dissipating semiconductor assemblyLUXNET CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →