Inventor · disambiguated record
Bo-Hao Ma
Also filed as: MA BO-HAO
6 granted patents·5 pending applications·10 citations·filing 2018–2024
73Inventor score
Top patents by PatentIndex Score
11 records- 0195US11315881B1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Apr 26, 2022·7 cites·14 claims
- 0279US10741500B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Aug 11, 2020·3 cites·17 claims
- 0373US12125828B2Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·12 claims
- 0472US2025015054A1Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0561US11289346B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·9 claims
- 0654US11923337B2Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Mar 5, 2024·0 cites·20 claims
- 0754US2023282625A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 0853US2023260866A1Semiconductor package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 0952US11195812B2Method for fabricating an encapsulated electronic package using a supporting plateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·10 claims
- 1052US2023282626A1High-bandwidth package-on-package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1151US2023046413A1Semiconductor package assemblyMEDIATEK INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →