Inventor · disambiguated record
Bok Gyu Min
Also filed as: MIN BOK GYU
12 granted patents·2 pending applications·7 citations·filing 2009–2024
82Inventor score
Top patents by PatentIndex Score
14 records- 0180US10312196B2Semiconductor packages including indicators for evaluating a distance and methods of calculating the distanceSK HYNIX INC·Filed 2018·Granted Jun 4, 2019·3 cites·13 claims
- 0272US12033952B2Semiconductor packages including at least one die position checkerSK HYNIX INC·Filed 2023·Granted Jul 9, 2024·0 cites·13 claims
- 0365US11764160B2Semiconductor packages including at least one die position checkerSK HYNIX INC·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 0460US11239177B2Semiconductor packages including die over-shift indicating patternsSK HYNIX INC·Filed 2020·Granted Feb 1, 2022·0 cites·6 claims
- 0559US8624375B2Semiconductor package for selecting semiconductor chip from a chip stackMIN BOK GYU·Filed 2010·Granted Jan 7, 2014·2 cites·37 claims
- 0659US2025157907A1Semiconductor package including trench structure, manufacturing method thereof, and strip substrateSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0758US8525319B2Selecting chips within a stacked semiconductor package using through-electrodesMIN BOK GYU·Filed 2010·Granted Sep 3, 2013·2 cites·28 claims
- 0855US10692816B2Semiconductor packages including die over-shift indicating patternsSK HYNIX INC·Filed 2018·Granted Jun 23, 2020·0 cites·11 claims
- 0948US11769700B2Semiconductor substrate, semiconductor package including semiconductor substrate, and test method of semiconductor substrateSK HYNIX INC·Filed 2020·Granted Sep 26, 2023·0 cites·10 claims
- 1046US2013040425A1Spiral staircase shaped stacked semiconductor package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2012·Application pending·0 cites
- 1144US9412716B2Semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2014·Granted Aug 9, 2016·0 cites·13 claims
- 1242US8242582B2Semiconductor package and stacked semiconductor package having the sameMIN BOK GYU·Filed 2009·Granted Aug 14, 2012·0 cites·18 claims
- 1338US8304879B2Spiral staircase shaped stacked semiconductor package and method for manufacturing the sameNAH DA UN·Filed 2010·Granted Nov 6, 2012·0 cites·14 claims
- 1434US8907490B2Semiconductor packages having the first and second chip inclined sidewalls contact with each otherJUNG SO HYUN·Filed 2012·Granted Dec 9, 2014·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →