Inventor · disambiguated record
Boon Ng
Also filed as: NG BOON · NG BOON HWEE BURNETTE
4 granted patents·1 pending application·5 citations·filing 2006–2016
61Inventor score
Top patents by PatentIndex Score
5 records- 0162US7985657B1Systems and methods for bonding materials using microwave energyMICROWAVE BONDING INSTR INC·Filed 2007·Granted Jul 26, 2011·3 cites·8 claims
- 0255US10343551B2Methods and apparatus for automatic alignment of wireless power transfer systemsELIX WIRELESS CHARGING SYSTEMS INC·Filed 2016·Granted Jul 9, 2019·2 cites·24 claims
- 0337US10389177B2Magnetic field configuration for a wireless energy transfer systemELIX WIRELESS CHARGING SYSTEMS INC·Filed 2016·Granted Aug 20, 2019·0 cites·22 claims
- 0437US7968426B1Systems and methods for bonding semiconductor substrates to metal substrates using microwave energyMICROWAVE BONDING INSTR INC·Filed 2006·Granted Jun 28, 2011·0 cites·7 claims
- 0535US2014049376A1Attachable device support with a communication meansNG BOON HWEE BURNETTE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →