Inventor · disambiguated record
Bo In Noh
Also filed as: NOH BO IN
3 granted patents·4 pending applications·3 citations·filing 2015–2025
55Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0179US10354967B2Metal pillar in a film-type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 16, 2019·3 cites·17 claims
- 0268US2025239552A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0366US12300649B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 0456US10867948B2Metal pillar in a film-type seconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 0532US2019027453A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0630US2015366050A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 0730US2019096836A1Bump structure, semiconductor package including the bump structure, and method of forming the bump structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →