Inventor · disambiguated record
Bo-Hsun Pan
Also filed as: PAN BO-HSUN
7 granted patents·2 pending applications·0 citations·filing 2018–2024
68Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC9
Top patents by PatentIndex Score
9 records- 0170US2024274569A1Integrated circuit die pad cavityTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0266US11942448B2Integrated circuit die pad cavityTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 26, 2024·0 cites·23 claims
- 0353US11735506B2Packages with multiple exposed padsTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 22, 2023·0 cites·30 claims
- 0452US11862538B2Semiconductor die mounted in a recess of die padTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 0550US11848297B2Semiconductor device packages with high angle wire bonding and non-gold bond wiresTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 0650US11817374B2Electronic device with exposed tie barTEXAS INSTRUMENTS INC·Filed 2021·Granted Nov 14, 2023·0 cites·23 claims
- 0748US11742265B2Exposed heat-generating devicesTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 29, 2023·0 cites·16 claims
- 0847US11081428B2Electronic device with three dimensional thermal padTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·22 claims
- 0946US2023317571A1Lead finger with z-direction obstruction featureTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →