Inventor · disambiguated record
Boydd Piper
Also filed as: PIPER BOYDD
3 granted patents·122 citations·filing 1992–1996
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0184US5276955AMultilayer interconnect system for an area array interconnection using solid state diffusionSUPERCOMPUTER SYSTEMS LTD·Filed 1992·Granted Jan 11, 1994·99 cites·29 claims
- 0246US5853517AMethod for coining solder balls on an electrical circuit packageGORE & ASS·Filed 1996·Granted Dec 29, 1998·14 cites·8 claims
- 0338US5882459AMethod for aligning and laminating substrates to stiffeners in electrical circuitsGORE & ASS·Filed 1996·Granted Mar 16, 1999·9 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →