Inventor · disambiguated record
Bo-Jhih Shen
Also filed as: SHEN BO · SHEN BO-JHIH
13 granted patents·5 pending applications·18 citations·filing 2006–2025
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9UNIV BEIJING3IBM2BEIJING INST OF SPACE LONG MARCH VEHICLE1HUAWEI CLOUD COMPUTING TECH CO LTD1
Top patents by PatentIndex Score
18 records- 0193US11567753B1Automated software patch mapping and recommendationIBM·Filed 2021·Granted Jan 31, 2023·3 cites·20 claims
- 0292US11043251B2Magnetic tunnel junction device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·11 cites·20 claims
- 0386US10566232B2Post-etch treatment of an electrically conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 18, 2020·3 cites·20 claims
- 0483US11570082B1Accurately identifying execution time of performance testIBM·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 0580US12322648B2Interlayer dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 0677US12266567B2Method of forming a barrier layer in an interconnect structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 0775US12154608B2Magnetic tunnel junction device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 0872US2025174493A1Interlayer dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0967US11990167B2Magnetic tunnel junction device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 1067US11335593B2Interconnect structure of semiconductor device including barrier layer located entirely in viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 1164US2025073737A1Apparatus for black oxide finishingSKF AB·Filed 2024·Application pending·0 cites
- 1260US2025272060A1Cloud Service-Based Code Generation Method and ApparatusHUAWEI CLOUD COMPUTING TECH CO LTD·Filed 2025·Application pending·0 cites
- 1359US11749563B2Interlayer dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 5, 2023·0 cites·20 claims
- 1452US2024079470A1Gan power device and manufacturing method thereofUNIV BEIJING·Filed 2023·Application pending·0 cites
- 1550US12051766B1Method for preparing nitride light emitting diode (LED) and nondestructive interface separationUNIV BEIJING·Filed 2022·Granted Jul 30, 2024·0 cites·10 claims
- 1646US12206041B2Method for monolithic integration preparation of full-color nitride semiconductor micro light-emitting diode arrayUNIV BEIJING·Filed 2022·Granted Jan 21, 2025·0 cites·10 claims
- 1743US2007053357A1System and method for mobile host implementing multicast serviceHUAWEI TECH CO LTD·Filed 2006·Application pending·0 cites
- 1832US12512916B2Fast calibration test system and method for phased-array antennaBEIJING INST OF SPACE LONG MARCH VEHICLE·Filed 2021·Granted Dec 30, 2025·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →