Inventor · disambiguated record
Bogdan M. Simion
Also filed as: SIMION BOGDAN M · SIMION BOGDAN MARIUS
9 granted patents·418 citations·filing 1999–2015
88Inventor score
Files withINTEL CORP4SIMION BOGDAN M2READ RITE CORP1SEAGATE TECHNOLOGY LLC1WESTERN DIGITAL FREMONT INC1
Top patents by PatentIndex Score
9 records- 0197US6185081B1Bias layers which are formed on underlayers promoting in-plane alignment of the c-axis of cobalt used in magnetoresistive transducersREAD RITE CORP·Filed 1999·Granted Feb 6, 2001·207 cites·26 claims
- 0296US6989972B1Magnetoresistive sensor with overlapping leads having distributed currentWESTERN DIGITAL FREMONT INC·Filed 2002·Granted Jan 24, 2006·187 cites·15 claims
- 0374US8534574B2Underfill material dispenserSIMION BOGDAN M·Filed 2010·Granted Sep 17, 2013·6 cites·12 claims
- 0471US8211501B2Fluorination pre-treatment of heat spreader attachment indium thermal interface materialSIMION BOGDAN M·Filed 2010·Granted Jul 3, 2012·3 cites·22 claims
- 0563US9899362B2Mold chase for integrated circuit package assembly and associated techniques and configurationsINTEL CORP·Filed 2015·Granted Feb 20, 2018·1 cites·18 claims
- 0663US7829195B2Fluorination pre-treatment of heat spreader attachment indium thermal interface materialINTEL CORP·Filed 2006·Granted Nov 9, 2010·2 cites·20 claims
- 0756US6278595B1Magnetoresistive sensor having a hard-biasing material and a cubic-titanium-tungsten underlayerSEAGATE TECHNOLOGY LLC·Filed 1999·Granted Aug 21, 2001·12 cites·12 claims
- 0849US9067342B2Mold chase for integrated circuit package assembly and associated techniques and configurationsINTEL CORP·Filed 2012·Granted Jun 30, 2015·0 cites·10 claims
- 0941US8366982B2Differential pressure underfill process and equipmentINTEL CORP·Filed 2010·Granted Feb 5, 2013·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →