Inventor · disambiguated record
Boon Teik Tee
Also filed as: TEE BOON TEIK
3 granted patents·1 citations·filing 2014–2019
53Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0157US9659843B2Lead frame strip with molding compound channelsINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 23, 2017·1 cites·9 claims
- 0253US10957633B2Semiconductor device packaging assembly, lead frame strip and unit lead frame with trenches or grooves for guiding liquefied molding materialINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 23, 2021·0 cites·6 claims
- 0347US10438870B2Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channelsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 8, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →