Inventor · disambiguated record
Boping Xie
Also filed as: XIE BOPING
12 granted patents·6 pending applications·108 citations·filing 1999–2023
88Inventor score
Top patents by PatentIndex Score
18 records- 0194US10598875B2Photonic package with a bridge between a photonic die and an optical coupling structureINTEL CORP·Filed 2018·Granted Mar 24, 2020·24 cites·20 claims
- 0286US11251228B2Optical receiver package with backside lens-integrated photodetector dieINTEL CORP·Filed 2018·Granted Feb 15, 2022·3 cites·20 claims
- 0384US10838042B2Scanning LIDAR system using a curved rotating surfaceBADONI VIPUL DUTT·Filed 2017·Granted Nov 17, 2020·11 cites·19 claims
- 0481US9122030B2Optical module including a clampXIE BOPING·Filed 2012·Granted Sep 1, 2015·10 cites·20 claims
- 0580US8340523B2Tunable optical filterSHEN JINXI·Filed 2009·Granted Dec 25, 2012·12 cites·11 claims
- 0678US12481035B2Silicon photonic systems for LIDAR applicationsINTEL CORP·Filed 2021·Granted Nov 25, 2025·1 cites·25 claims
- 0778US6372329B1Ink-jet recording media having ink-receptive layers comprising modified poly(vinyl alcohols)ARKWRIGHT INC·Filed 1999·Granted Apr 16, 2002·47 cites·19 claims
- 0866US12298556B2Wire-bonding methodologies utilizing preformed glass optical wires for making chip-to-chip optical interfacesINTEL CORP·Filed 2021·Granted May 13, 2025·0 cites·14 claims
- 0959US12449605B2System, apparatus and method for integrating laser and optical circuitry on a photonics integrated circuit using an assembly having a prism and isolatorINTEL CORP·Filed 2021·Granted Oct 21, 2025·0 cites·17 claims
- 1059US12442990B2Technologies for coupling from photonic integrated circuits with an optical isolatorINTEL CORP·Filed 2021·Granted Oct 14, 2025·0 cites·25 claims
- 1156US2023318247A1Package with multiple photonic integrated circuit dies optically coupled with each otherINTEL CORP·Filed 2022·Application pending·0 cites
- 1251US9405082B2OSA cage with reinforced connection to PCBLUMENTUM OPERATIONS LLC·Filed 2013·Granted Aug 2, 2016·0 cites·20 claims
- 1349US2024361541A1Apparatus and methods for optical alignment for photonic integrated circuitsINTEL CORP·Filed 2023·Application pending·0 cites
- 1449US2023204856A1Thermal control for chip to chip optical couplingINTEL CORP·Filed 2021·Application pending·0 cites
- 1546US12052058B2Optical transceiver integrated circuitINTEL CORP·Filed 2020·Granted Jul 30, 2024·0 cites·18 claims
- 1645US2021210478A1Packaging solutions for high bandwidth networking applicationsINTEL CORP·Filed 2021·Application pending·0 cites
- 1743US2024069287A1Novel design for fiber array unit (fau) for optical transceiver productsINTEL CORP·Filed 2021·Application pending·0 cites
- 1831US2006182484A1Printing methods, folding methods, and packaging methods for album photo coversEPSON AMERICA INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →