Inventor · disambiguated record
Bohan Yan
Also filed as: YAN BOHAN
3 granted patents·6 pending applications·1 citations·filing 2018–2024
47Inventor score
Files withQUALCOMM INC9
Top patents by PatentIndex Score
9 records- 0166US10679919B2High thermal release interposerQUALCOMM INC·Filed 2018·Granted Jun 9, 2020·1 cites·20 claims
- 0259US2025357238A1Package including substrates, integrated devices, and heat slugQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0357US2025300035A1Package comprising an embedded heat pipeQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0454US2025293211A1Heat dissipation for stacked integrated circuit devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0554US2025293111A1Lid through interposer of semiconductor package for thermal managementQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0652US11749579B2Thermal structures adapted to electronic device heights in integrated circuit (IC) packagesQUALCOMM INC·Filed 2021·Granted Sep 5, 2023·0 cites·22 claims
- 0750US2025357248A1Device comprising thermally anisotropic conductive channels and thermally insulating materialQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0849US11437335B2Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methodsQUALCOMM INC·Filed 2020·Granted Sep 6, 2022·0 cites·29 claims
- 0942US2021249359A1Package with integrated structureQUALCOMM INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →