Inventor · disambiguated record
Bong-Wee Yu
Also filed as: YU BONG WEE
1 granted patent·1 pending application·5 citations·filing 2001–2024
26Inventor score
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2 records- 0156US2025062238A1Semiconductor package and integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0248US7327797B2Orthogonal frequency division multiplexing (OFDM) receiving device for forming beam with uneven width by channel property, communication device using the same, and method thereofYU BONG-WEE·Filed 2001·Granted Feb 5, 2008·5 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →