Inventor · disambiguated record
Bongwee Yu
Also filed as: YU BONGWEE
1 granted patent·3 pending applications·0 citations·filing 2021–2024
2Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0154US2024282672A1Semiconductor device including a three-dimensional integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0253US2025183170A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0349US2024290738A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0441US12224260B2Semiconductor package including a dualized signal wiring structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →