Inventor · disambiguated record
Brian Balch
Also filed as: BALCH BRIAN · BALCH BRIAN P
0 granted patents·5 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0155US2025006646A1Through glass vias with compliant layer for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0252US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0351US2025006614A1Intervening layers for thru-via seed metallizationSHANMUGAM RENGARAJAN·Filed 2023·Application pending·0 cites
- 0451US2023402368A1Technologies for thin film resistors in viasINTEL CORP·Filed 2022·Application pending·0 cites
- 0550US2024006300A1Substrates having adhesion promotor layers and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →