Inventor · disambiguated record
Bradley R. Bitz
Also filed as: BITZ BRADLEY · BITZ BRADLEY R · BITZ BRADLEY RUSSELL
14 granted patents·8 pending applications·24 citations·filing 2007–2025
88Inventor score
Top patents by PatentIndex Score
22 records- 0190US10916487B2Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 9, 2021·5 cites·23 claims
- 0289US10424531B2Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 24, 2019·5 cites·11 claims
- 0388US9960150B2Semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2016·Granted May 1, 2018·5 cites·18 claims
- 0475US10074633B2Semiconductor die assemblies having molded underfill structures and related technologyMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 11, 2018·2 cites·22 claims
- 0573US11004828B2Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2019·Granted May 11, 2021·2 cites·29 claims
- 0670US11688664B2Semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 27, 2023·0 cites·18 claims
- 0767US12376219B2Circuit board structures for component protectionMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 29, 2025·0 cites·25 claims
- 0866US12207411B2Printed wiring boards, printed wiring board assemblies, and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 21, 2025·0 cites·19 claims
- 0965US11749666B2Semiconductor die assemblies having molded underfill structures and related technologyMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 5, 2023·0 cites·19 claims
- 1064US2025159813A1Printed circuit boards, and related assemblies and electronic systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1163US8709878B2Methods of packaging imager devices and optics modules, and resulting assembliesBOLKEN TODD·Filed 2012·Granted Apr 29, 2014·2 cites·13 claims
- 1261US11676955B2Separation method and assembly for chip-on-wafer processingMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 13, 2023·0 cites·14 claims
- 1361US8110884B2Methods of packaging imager devices and optics modules, and resulting assembliesBOLKEN TODD·Filed 2007·Granted Feb 7, 2012·3 cites·21 claims
- 1457US2025234452A1Module-level thermal management mechanismMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1557US2025157885A1Memory module with extended conductive plane for heat dissipationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1655US10804256B2Semiconductor die assemblies having molded underfill structures and related technologyMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 13, 2020·0 cites·19 claims
- 1754US2024206069A1Printed circuit board over printed circuit board assemblyMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1853US2025379157A1Label support structure including a filler materialMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1948US2025254819A1Thermal correction for enclosuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2046US2024117855A1A damper for a printed circuit board assemblyMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2144US11997782B2Thermally conductive label for circuitMICRON TECHNOLOGY INC·Filed 2021·Granted May 28, 2024·0 cites·17 claims
- 2243US2023216225A1Connector for coupling a capacitor to a printed circuit board assemblyMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →