Inventor · disambiguated record
Bradley H. Carter
Also filed as: CARTER BRADLEY H · CARTER BRADLEY HOWARD
12 granted patents·3 pending applications·268 citations·filing 1993–2013
91Inventor score
Files withDELPHI TECH INC9DELCO ELECTRONICS CORP3FLEDERBACH LYNDA G1KUHLMAN FREDERICK F1SHORT JASON C1
Top patents by PatentIndex Score
15 records- 0194US5803340AComposite solder paste for flip chip bumpingDELCO ELECTRONICS CORP·Filed 1995·Granted Sep 8, 1998·114 cites·17 claims
- 0287US6767411B2Lead-free solder alloy and solder reflow processDELPHI TECH INC·Filed 2002·Granted Jul 27, 2004·43 cites·43 claims
- 0377US6630251B1Leach-resistant solder alloys for silver-based thick-film conductorsDELPHI TECH INC·Filed 2002·Granted Oct 7, 2003·21 cites·31 claims
- 0476US5938862AFatigue-resistant lead-free alloyDELCO ELECTRONICS CORP·Filed 1998·Granted Aug 17, 1999·39 cites·11 claims
- 0573US6811892B2Lead-based solder alloys containing copperDELPHI TECH INC·Filed 2002·Granted Nov 2, 2004·19 cites·20 claims
- 0673US6570260B1Solder process and solder alloy thereforDELPHI TECH INC·Filed 2002·Granted May 27, 2003·13 cites·17 claims
- 0755US9291136B2Fuel injector with a trimmable heater and an increased heater contact areaDELPHI TECH INC·Filed 2013·Granted Mar 22, 2016·0 cites·4 claims
- 0851US6619536B2Solder process and solder alloy thereforDELPHI TECH INC·Filed 2003·Granted Sep 16, 2003·3 cites·14 claims
- 0939US7294390B2Method for improving the thermal cycled adhesion of thick-film conductors on dielectricDELPHI TECH INC·Filed 2005·Granted Nov 13, 2007·0 cites·4 claims
- 1039US6221514B1High-current circuit trace and composition and method thereforDELPHI TECH INC·Filed 1999·Granted Apr 24, 2001·9 cites·30 claims
- 1139US2006255476A1Electronic assembly with controlled solder joint thicknessKUHLMAN FREDERICK F·Filed 2005·Application pending·0 cites
- 1239US2012048962A1Fuel Injector with a Trimmable Heater and an Increased Heater Contact AreaSHORT JASON C·Filed 2010·Application pending·0 cites
- 1338US2009001546A1Ultra-thick thick film on ceramic substrateFLEDERBACH LYNDA G·Filed 2007·Application pending·0 cites
- 1436US6328914B1Thick-film paste with insoluble additiveDELPHI TECH INC·Filed 1999·Granted Dec 11, 2001·6 cites·14 claims
- 1525US5464570ATHFA/PDP thermoset thick films for printed circuitsDELCO ELECTRONICS CORP·Filed 1993·Granted Nov 7, 1995·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →