Inventor · disambiguated record
Bruce J. Chamberlin
Also filed as: CHAMBERLIN BRUCE · CHAMBERLIN BRUCE J · CHAMBERLIN BRUCE JOHN
54 granted patents·7 pending applications·467 citations·filing 1998–2019
98Inventor score
Top patents by PatentIndex Score
61 records- 0196US6407341B1Conductive substructures of a multilayered laminateIBM·Filed 2000·Granted Jun 18, 2002·138 cites·3 claims
- 0293US7709951B2Thermal pillowIBM·Filed 2007·Granted May 4, 2010·27 cites·20 claims
- 0391US9839131B2Embedding a discrete electrical device in a printed circuit boardIBM·Filed 2015·Granted Dec 5, 2017·7 cites·19 claims
- 0491US7199309B2Structure for repairing or modifying surface connections on circuit boardsIBM·Filed 2005·Granted Apr 3, 2007·19 cites·11 claims
- 0589US10212828B1Via stub elimination by disrupting platingIBM·Filed 2017·Granted Feb 19, 2019·4 cites·1 claims
- 0688US10405421B2Selective dielectric resin application on circuitized core layersIBM·Filed 2017·Granted Sep 3, 2019·3 cites·2 claims
- 0788US9863875B1In-situ detection of hollow glass fiber formationIBM·Filed 2016·Granted Jan 9, 2018·2 cites·13 claims
- 0888US7795724B2Sandwiched organic LGA structureIBM·Filed 2007·Granted Sep 14, 2010·16 cites·12 claims
- 0986US6235994B1Thermal/electrical break for printed circuit boardsIBM·Filed 1998·Granted May 22, 2001·67 cites·24 claims
- 1085US6784377B2Method and structure for repairing or modifying surface connections on circuit boardsIBM·Filed 2002·Granted Aug 31, 2004·25 cites·2 claims
- 1185US6495772B2High performance dense wire for printed circuit boardIBM·Filed 2001·Granted Dec 17, 2002·35 cites·12 claims
- 1281US9986637B2Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making sameIBM·Filed 2016·Granted May 29, 2018·3 cites·8 claims
- 1381US7137826B2Temperature dependent semiconductor module connectorsIBM·Filed 2005·Granted Nov 21, 2006·8 cites·14 claims
- 1477US10932363B2Glass fiber coatings for improved resistance to conductive anodic filament formationIBM·Filed 2019·Granted Feb 23, 2021·0 cites·5 claims
- 1577US9398702B2Manufacturing a product using a soldering processIBM·Filed 2014·Granted Jul 19, 2016·2 cites·15 claims
- 1677US7856341B2Heat sinkIBM·Filed 2008·Granted Dec 21, 2010·11 cites·23 claims
- 1777US7615705B2Enhanced-reliability printed circuit board for tight-pitch componentsIBM·Filed 2006·Granted Nov 10, 2009·6 cites·9 claims
- 1876US9456496B2Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making sameIBM·Filed 2015·Granted Sep 27, 2016·2 cites·13 claims
- 1975US6912780B2Method and structure for repairing or modifying surface connections on circuit boardsIBM·Filed 2004·Granted Jul 5, 2005·14 cites·8 claims
- 2073US7109722B2Apparatus and method for PCB smoke and burn detection and preventionIBM·Filed 2004·Granted Sep 19, 2006·16 cites·17 claims
- 2172US10194537B2Minimizing printed circuit board warpageIBM·Filed 2013·Granted Jan 29, 2019·2 cites·14 claims
- 2268US10578551B2In-situ detection of hollow glass fiber formationIBM·Filed 2017·Granted Mar 3, 2020·0 cites·20 claims
- 2368US7355125B2Printed circuit board and chip moduleIBM·Filed 2005·Granted Apr 8, 2008·4 cites·1 claims
- 2467US6565367B2Zero insertion force compliant pin contact and assemblyIBM·Filed 2001·Granted May 20, 2003·17 cites·3 claims
- 2565US2019342994A1Selective dielectric resin application on circuitized core layersIBM·Filed 2019·Application pending·0 cites
- 2665US2019342995A1Selective dielectric resin application on circuitized core layersIBM·Filed 2019·Application pending·0 cites
- 2764US10617014B2Via stub elimination by disrupting platingIBM·Filed 2019·Granted Apr 7, 2020·0 cites·11 claims
- 2863US11178757B2Selective dielectric resin application on circuitized core layersIBM·Filed 2018·Granted Nov 16, 2021·0 cites·14 claims
- 2963US10684220B2In-situ detection of glass fiber defectsIBM·Filed 2017·Granted Jun 16, 2020·0 cites·8 claims
- 3063US10674613B2Via stub elimination by disrupting platingIBM·Filed 2019·Granted Jun 2, 2020·0 cites·3 claims
- 3163US10342122B2Interface for limiting substrate damage due to discrete failureIBM·Filed 2018·Granted Jul 2, 2019·0 cites·14 claims
- 3263US7128579B1Hook interconnectIBM·Filed 2005·Granted Oct 31, 2006·7 cites·20 claims
- 3361US10959339B2Manufacturing a product using a soldering processIBM·Filed 2018·Granted Mar 23, 2021·0 cites·10 claims
- 3461US7255571B2Temperature dependent semiconductor module connectorsIBM·Filed 2006·Granted Aug 14, 2007·1 cites·19 claims
- 3561US6832436B2Method for forming a substructure of a multilayered laminateIBM·Filed 2002·Granted Dec 21, 2004·8 cites·19 claims
- 3660US10982060B2Glass-free dielectric layers for printed circuit boardsIBM·Filed 2018·Granted Apr 20, 2021·0 cites·18 claims
- 3760US10492289B2Coating for limiting substrate damage due to discrete failureIBM·Filed 2017·Granted Nov 26, 2019·0 cites·20 claims
- 3860US10080283B1Interface for limiting substrate damage due to discrete failureIBM·Filed 2017·Granted Sep 18, 2018·0 cites·10 claims
- 3959US11523519B2Fabricating an asymmetric printed circuit board with minimized warpageIBM·Filed 2019·Granted Dec 6, 2022·0 cites·18 claims
- 4059US10470290B2Coating for limiting substrate damage due to discrete failureIBM·Filed 2017·Granted Nov 5, 2019·0 cites·20 claims
- 4159US7180752B2Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applicationsIBM·Filed 2004·Granted Feb 20, 2007·10 cites·10 claims
- 4257US10010000B2Manufacturing a product using a soldering processIBM·Filed 2016·Granted Jun 26, 2018·0 cites·16 claims
- 4356US10590037B2Liquid immersion techniques for improved resistance to conductive anodic filament formationIBM·Filed 2017·Granted Mar 17, 2020·0 cites·15 claims
- 4456US10462900B2Glass fiber coatings for improved resistance to conductive anodic filament formationIBM·Filed 2016·Granted Oct 29, 2019·0 cites·9 claims
- 4556US2018318969A1Solder for Limiting Substrate Damage Due to Discrete FailureIBM·Filed 2017·Application pending·0 cites
- 4655US6426466B1Peripheral power board structureIBM·Filed 2000·Granted Jul 30, 2002·5 cites·24 claims
- 4755US2018318968A1Solder for Limiting Substrate Damage Due to Discrete FailureIBM·Filed 2017·Application pending·0 cites
- 4854US10149388B2Method for embedding a discrete electrical device in a printed circuit boardIBM·Filed 2016·Granted Dec 4, 2018·0 cites·19 claims
- 4954US6437252B2Method and structure for reducing power noiseIBM·Filed 2000·Granted Aug 20, 2002·6 cites·18 claims
- 5052US10172243B2Printed circuit board and methods to enhance reliabilityIBM·Filed 2016·Granted Jan 1, 2019·0 cites·12 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →