Inventor · disambiguated record
Brent Donald Alfred Elliot
Also filed as: ELLIOT BRENT · ELLIOT BRENT D · ELLIOT BRENT DONALD ALFRED
36 granted patents·13 pending applications·513 citations·filing 1991–2024
97Inventor score
Files withWATLOW ELECTRIC MFG18COMPONENT RE ENG COMPANY INC13COMPONENT RE ENGINEERING COMPANY INC5INSYNC SYSTEMS INC4COMPONENT RE ENGINEERING COMPA2
Top patents by PatentIndex Score
49 records- 0195US5836355ABuilding blocks for integrated gas panelINSYNC SYSTEMS INC·Filed 1996·Granted Nov 17, 1998·148 cites·25 claims
- 0294US5605179AIntegrated gas panelINSYNC SYSTEMS INC·Filed 1995·Granted Feb 25, 1997·209 cites·3 claims
- 0390US12397379B2Nickel-carbon and nickel-cobalt-carbon brazes and brazing processes for joining ceramics and metals and semiconductor processing and industrial equipment using sameWATLOW ELECTRIC MFG·Filed 2024·Granted Aug 26, 2025·0 cites·17 claims
- 0489US11712745B2Semiconductor substrate support with multiple electrodes and method for making sameWATLOW ELECTRIC MFG·Filed 2022·Granted Aug 1, 2023·1 cites·14 claims
- 0589US6302141B1Building blocks for integrated gas panelINSYNC SYSTEMS INC·Filed 1997·Granted Oct 16, 2001·64 cites·99 claims
- 0687US8684256B2Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processingCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 1, 2014·7 cites·10 claims
- 0787US7098428B1System and method for an improved susceptorELLIOT BRENT·Filed 2005·Granted Aug 29, 2006·20 cites·20 claims
- 0886US9624137B2Low temperature method for hermetically joining non-diffusing ceramic materialsCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2014·Granted Apr 18, 2017·6 cites·26 claims
- 0986US8789743B2Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materialsCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Jul 29, 2014·5 cites·19 claims
- 1082US11091397B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesWATLOW ELECTRIC MFG·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 1182US2023321766A1Nickel-Carbon And Nickel-Cobalt-Carbon Brazes And Brazing Processes For Joining Ceramics And Metals And Semiconductor Processing And Industrial Equipment Using SameWATLOW ELECTRIC MFG·Filed 2023·Application pending·0 cites
- 1278US12128494B2Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2023·Granted Oct 29, 2024·0 cites·13 claims
- 1378US2025050439A1Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 1477US8932690B2Plate and shaft deviceELLIOT ALFRED GRANT·Filed 2012·Granted Jan 13, 2015·4 cites·13 claims
- 1575US11331738B2High temperature resistant silicon joint for the joining of ceramicsWATLOW ELECTRIC MFG·Filed 2019·Granted May 17, 2022·0 cites·20 claims
- 1674US10646941B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 12, 2020·1 cites·16 claims
- 1773US11993547B2Termination feedthrough unit with ceramic insulator for vacuum and corrosive applicationsWATLOW ELECTRIC MFG·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 1873US11666993B2Nickel-carbon and nickel-cobalt-carbon brazes and brazing processes for joining ceramics and metals and semiconductor processing and industrial equipment using sameWATLOW ELECTRIC MFG·Filed 2019·Granted Jun 6, 2023·0 cites·14 claims
- 1971US10471531B2High temperature resistant silicon joint for the joining of ceramicsCOMPONENT RE ENG COMPANY INC·Filed 2015·Granted Nov 12, 2019·1 cites·11 claims
- 2071US10384283B2Method for making a high temperature resistant silicon alloy joint for the joining of ceramics and devices using sameCOMPONENT RE ENG COMPANY INC·Filed 2015·Granted Aug 20, 2019·1 cites·1 claims
- 2170US9984866B2Multiple zone heaterCOMPONENT RE ENG COMPANY INC·Filed 2013·Granted May 29, 2018·2 cites·7 claims
- 2269US12020971B2Method for joining quartz pieces and quartz electrodes and other devices of joined quartzWATLOW ELECTRIC MFG·Filed 2021·Granted Jun 25, 2024·0 cites·15 claims
- 2369US10593584B2Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Mar 17, 2020·1 cites·27 claims
- 2469US9556074B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2012·Granted Jan 31, 2017·1 cites·23 claims
- 2569US9315424B2Multi-layer plate deviceCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 19, 2016·1 cites·19 claims
- 2667US10153183B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2014·Granted Dec 11, 2018·1 cites·10 claims
- 2761US11222804B2Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameWATLOW ELECTRIC MFG·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 2861US10991616B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2018·Granted Apr 27, 2021·0 cites·7 claims
- 2961US2024404869A1Solid-state bonding method for the manufacture of semiconductor chucks and heatersWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 3060US11648620B2Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2018·Granted May 16, 2023·0 cites·13 claims
- 3157US11823890B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 3257US11183412B2Method for joining quartz pieces and quartz electrodes and other devices of joined quartzWATLOW ELECTRIC MFG·Filed 2018·Granted Nov 23, 2021·0 cites·20 claims
- 3357US10213858B2Multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Feb 26, 2019·0 cites·15 claims
- 3456US5178651AMethod for purifying gas distribution systemsBALMA FRANK R·Filed 1991·Granted Jan 12, 1993·20 cites·3 claims
- 3555US10287215B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 14, 2019·0 cites·14 claims
- 3654US11495450B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2018·Granted Nov 8, 2022·0 cites·16 claims
- 3753US6231260B1Mounting plane for integrated gas panelINSYNC SYSTEMS INC·Filed 1997·Granted May 15, 2001·18 cites·29 claims
- 3853US2022361296A1Metal heater assembly with embedded resistive heatersWATLOW ELECTRIC MFG·Filed 2022·Application pending·0 cites
- 3952US2019066980A1Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Semiconductor Processing ApplicationsCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
- 4049US11028021B2Termination feedthrough unit with ceramic insulator suitable for vacuum and corrosive applicationsWATLOW ELECTRIC MFG·Filed 2018·Granted Jun 8, 2021·0 cites·16 claims
- 4148US9999947B2Method for repairing heaters and chucks used in semiconductor processingCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Jun 19, 2018·0 cites·22 claims
- 4248US2019366459A1Method for repairing heaters and chucks used in semiconductor processingCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
- 4347US2007169703A1Advanced ceramic heater for substrate processingELLIOT BRENT·Filed 2006·Application pending·0 cites
- 4447US2010177454A1Electrostatic chuck with dielectric insertsCOMPONENT RE ENGINEERING COMPA·Filed 2009·Application pending·0 cites
- 4547US2018354861A1Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Industrial ApplicationsCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
- 4646US2008314320A1Chamber Mount for High Temperature Application of AIN HeatersCOMPONENT RE ENGINEERING COMPA·Filed 2008·Application pending·0 cites
- 4743US2014014710A1Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized RegionsCOMPONENT RE ENGINEERING COMPNAY INC·Filed 2013·Application pending·0 cites
- 4837US2004250774A1Wafer heater with protected heater elementFiled 2003·Application pending·0 cites
- 4935US2016005528A1High performance high current power inductorCOOPER TECHNOLOGIES CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →