Inventor · disambiguated record
Brian Franco
Also filed as: FRANCO BRIAN
0 granted patents·3 pending applications·0 citations·filing 2023–2023
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0168US2025128362A1Micrometer metal particle reinforced tin-bismuth low temperature solder materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 0259US2025218992A1Core-shell ball grid array materials for large form factor integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0359US2025112198A1In-cavity epoxy placement for package reliabilityINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →