Inventor · disambiguated record
Bruce K. Furman
Also filed as: FURMAN BRUCE · FURMAN BRUCE K · FURMAN BRUCE KENNETH
58 granted patents·15 pending applications·2,548 citations·filing 1991–2013
99Inventor score
Top patents by PatentIndex Score
73 records- 0199US7855101B2Layer transfer process and functionally enhanced integrated circuits produced therebyIBM·Filed 2009·Granted Dec 21, 2010·102 cites·14 claims
- 0299US7030481B2High density chip carrier with integrated passive devicesIBM·Filed 2002·Granted Apr 18, 2006·401 cites·52 claims
- 0399US6962872B2High density chip carrier with integrated passive devicesIBM·Filed 2004·Granted Nov 8, 2005·363 cites·29 claims
- 0498US7978473B2Cooling apparatus with cold plate formed in situ on a surface to be cooledIBM·Filed 2010·Granted Jul 12, 2011·68 cites·20 claims
- 0597US5981970AThin-film field-effect transistor with organic semiconductor requiring low operating voltagesIBM·Filed 1997·Granted Nov 9, 1999·232 cites·20 claims
- 0697US5946551AFabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectricFiled 1997·Granted Aug 31, 1999·275 cites·31 claims
- 0796US7344907B2Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scaleIBM·Filed 2004·Granted Mar 18, 2008·82 cites·13 claims
- 0896US7116886B2Devices and methods for side-coupling optical fibers to optoelectronic componentsIBM·Filed 2005·Granted Oct 3, 2006·52 cites·3 claims
- 0995US7731079B2Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooledIBM·Filed 2008·Granted Jun 8, 2010·31 cites·9 claims
- 1095US6331356B1Patterns of electrically conducting polymers and their application as electrodes or electrical contactsIBM·Filed 1998·Granted Dec 18, 2001·131 cites·32 claims
- 1192US6344660B1Thin-film field-effect transistor with organic semiconductor requiring low operating voltagesIBM·Filed 1999·Granted Feb 5, 2002·108 cites·23 claims
- 1291US8617689B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formedCHEN KUAN-NENG·Filed 2012·Granted Dec 31, 2013·10 cites·9 claims
- 1391US8156998B2Patterned metal thermal interfaceFURMAN BRUCE K·Filed 2010·Granted Apr 17, 2012·12 cites·18 claims
- 1491US7834442B2Electronic package method and structure with cure-melt hierarchyIBM·Filed 2007·Granted Nov 16, 2010·24 cites·20 claims
- 1591US7786001B2Electrical interconnect structure and methodIBM·Filed 2007·Granted Aug 31, 2010·16 cites·9 claims
- 1690US7868457B2Thermo-compression bonded electrical interconnect structure and methodIBM·Filed 2007·Granted Jan 11, 2011·17 cites·8 claims
- 1790US7694719B2Patterned metal thermal interfaceIBM·Filed 2007·Granted Apr 13, 2010·18 cites·16 claims
- 1890US6955481B2Method and apparatus for providing parallel optoelectronic communication with an electronic deviceIBM·Filed 2003·Granted Oct 18, 2005·43 cites·20 claims
- 1989US8002477B2Devices and methods for side-coupling optical fibers to optoelectronic componentsIBM·Filed 2008·Granted Aug 23, 2011·14 cites·7 claims
- 2089US7482197B2Method and apparatus for deploying a liquid metal thermal interface for chip coolingIBM·Filed 2005·Granted Jan 27, 2009·15 cites·19 claims
- 2189US6874950B2Devices and methods for side-coupling optical fibers to optoelectronic componentsIBM·Filed 2002·Granted Apr 5, 2005·31 cites·16 claims
- 2288US8541291B2Thermo-compression bonded electrical interconnect structure and methodFURMAN BRUCE K·Filed 2011·Granted Sep 24, 2013·8 cites·20 claims
- 2387US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 2486US5258236AMulti-layer thin film structure and parallel processing method for fabricating sameIBM·Filed 1991·Granted Nov 2, 1993·92 cites·7 claims
- 2585US7683478B2Hermetic seal and reliable bonding structures for 3D applicationsIBM·Filed 2008·Granted Mar 23, 2010·9 cites·3 claims
- 2685US7537709B2Method for isotropic etching of copperIBM·Filed 2006·Granted May 26, 2009·9 cites·12 claims
- 2784US7863070B2Methods for encapsulating microelectromechanical (MEM) devices on a wafer scaleIBM·Filed 2008·Granted Jan 4, 2011·8 cites·13 claims
- 2884US7056648B2Method for isotropic etching of copperIBM·Filed 2003·Granted Jun 6, 2006·29 cites·15 claims
- 2984US5804100ADeaggregated electrically conductive polymers and precursors thereofIBM·Filed 1995·Granted Sep 8, 1998·35 cites·37 claims
- 3082US7440668B2Devices and methods for side-coupling optical fibers to optoelectronic componentsIBM·Filed 2006·Granted Oct 21, 2008·8 cites·14 claims
- 3181US7095474B2Patterns of electrically conducting polymers and their application as electrodes or electrical contactsIBM·Filed 2001·Granted Aug 22, 2006·15 cites·17 claims
- 3280US8241995B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectricCHEN KUAN-NENG·Filed 2006·Granted Aug 14, 2012·7 cites·18 claims
- 3379US8043893B2Thermo-compression bonded electrical interconnect structure and methodIBM·Filed 2007·Granted Oct 25, 2011·8 cites·15 claims
- 3478US6697037B1TFT LCD active data line repairIBM·Filed 1996·Granted Feb 24, 2004·56 cites·14 claims
- 3577US7898076B2Structure and methods of processing for solder thermal interface materials for chip coolingIBM·Filed 2007·Granted Mar 1, 2011·7 cites·16 claims
- 3677US5534094AMethod for fabricating multi-layer thin film structure having a separation layerIBM·Filed 1994·Granted Jul 9, 1996·54 cites·7 claims
- 3775US8541299B2Electrical interconnect forming methodBUCHWALTER STEPHEN LESLIE·Filed 2010·Granted Sep 24, 2013·3 cites·19 claims
- 3873US6732908B2High density raised stud microjoining system and methods of fabricating the sameIBM·Filed 2002·Granted May 11, 2004·19 cites·15 claims
- 3972US6806349B2Methods of fabrication of deaggregated electrically conductive polymers and precursors thereofIBM·Filed 2001·Granted Oct 19, 2004·9 cites·12 claims
- 4071US7786596B2Hermetic seal and reliable bonding structures for 3D applicationsIBM·Filed 2008·Granted Aug 31, 2010·3 cites·5 claims
- 4170US8476773B2Electrical interconnect structureBUCHWALTER STEPHEN LESLIE·Filed 2010·Granted Jul 2, 2013·2 cites·20 claims
- 4270US5736623AMethods of fabrication of deaggregated electrically conductive polymers and precursors thereofIBM·Filed 1995·Granted Apr 7, 1998·24 cites·19 claims
- 4368US7804048B2Structure for cooling a surfaceIBM·Filed 2007·Granted Sep 28, 2010·3 cites·18 claims
- 4468US7288840B2Structure for cooling a surfaceIBM·Filed 2005·Granted Oct 30, 2007·3 cites·19 claims
- 4567US8164192B2Thermo-compression bonded electrical interconnect structureFURMAN BRUCE K·Filed 2011·Granted Apr 24, 2012·1 cites·17 claims
- 4667US6752935B2Deaggregated electrically conductive polymers and precursors thereofIBM·Filed 2001·Granted Jun 22, 2004·5 cites·17 claims
- 4765US7952193B2Method and apparatus for deploying a liquid metal thermal interface for chip coolingIBM·Filed 2008·Granted May 31, 2011·2 cites·10 claims
- 4864US8242010B2Electrical interconnect forming methodBUCHWALTER STEPHEN LESLIE·Filed 2010·Granted Aug 14, 2012·1 cites·20 claims
- 4956US8927087B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formedIBM·Filed 2013·Granted Jan 6, 2015·0 cites·14 claims
- 5056US2009233079A1Techniques for Layer Transfer ProcessingIBM·Filed 2009·Application pending·0 cites
Showing the top 50 of 73 patent records by PatentIndex Score.
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