Inventor · disambiguated record
Brian F. Gordon
Also filed as: DOBSON TODD A · GORDON BRIAN F
29 granted patents·848 citations·filing 1997–2007
97Inventor score
Files withMICRON TECHNOLOGY INC29
Top patents by PatentIndex Score
29 records- 0199US6410459B2Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 25, 2002·539 cites·16 claims
- 0295US6103636AMethod and apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 15, 2000·122 cites·64 claims
- 0388US6329301B1Method and apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 11, 2001·25 cites·64 claims
- 0484US6447634B1Method and apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 10, 2002·23 cites·31 claims
- 0579US6898838B2Inflatable bladder with suction for supporting circuit board assembly processingMICRON TECHNOLOGY INC·Filed 2004·Granted May 31, 2005·18 cites·41 claims
- 0679US6610610B2Methods for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·13 cites·64 claims
- 0776US6506679B2Deadhesion method and mechanism for wafer processingMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·14 cites·183 claims
- 0872US6530113B2Apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 11, 2003·8 cites·31 claims
- 0967US7093704B2Printed circuit board supportMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 22, 2006·3 cites·7 claims
- 1066US6316363B1Deadhesion method and mechanism for wafer processingMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 13, 2001·23 cites·183 claims
- 1163US6569241B2Substrate spinning apparatusMICRON TECHNOLOGY INC·Filed 2002·Granted May 27, 2003·6 cites·20 claims
- 1261US6398868B1Substrate coating apparatusMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 4, 2002·5 cites·10 claims
- 1360US6631798B1Printed circuit board supportMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 14, 2003·5 cites·10 claims
- 1458US8053371B2Apparatus and methods for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 8, 2011·0 cites·18 claims
- 1558US7244681B2Methods for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 17, 2007·3 cites·19 claims
- 1658US6889698B2Apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2003·Granted May 10, 2005·3 cites·17 claims
- 1757US6429146B2Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·3 cites·2 claims
- 1856US6857627B2Inflatable bladder with suction for supporting circuit board assembly processingMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 22, 2005·5 cites·80 claims
- 1956US6232247B1Substrate coating apparatus and semiconductor processing method of improving uniformity of liquid depositionMICRON TECHNOLOGY INC·Filed 1999·Granted May 15, 2001·14 cites·34 claims
- 2055US6749054B2Printed circuit board supportMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 15, 2004·3 cites·6 claims
- 2155US6555276B2Substrate coating and semiconductor processing method of improving uniformity of liquid depositionMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 29, 2003·4 cites·20 claims
- 2254US6863170B2Printed circuit board supportMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 8, 2005·3 cites·5 claims
- 2352US6693034B2Deadhesion method and mechanism for wafer processingMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·2 cites·183 claims
- 2451US6971499B2Printed circuit board supportMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 6, 2005·2 cites·15 claims
- 2547US6962248B2Printed circuit board supportMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 8, 2005·1 cites·15 claims
- 2647US6863169B2Printed circuit board supportMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 8, 2005·1 cites·9 claims
- 2743US6624089B2Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 23, 2003·0 cites·13 claims
- 2842US6656402B2Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 2, 2003·0 cites·16 claims
- 2942US6645345B2Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processingMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 11, 2003·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →