Inventor · disambiguated record
Brian Hoekstra
Also filed as: HOEKSTRA BRIAN · HOEKSTRA BRIAN L
6 granted patents·1 pending application·1,117 citations·filing 1999–2005
90Inventor score
Top patents by PatentIndex Score
7 records- 0195US6211488B1Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribeACCUDYNE DISPLAY AND SEMICONDU·Filed 1999·Granted Apr 3, 2001·317 cites·24 claims
- 0294US6489588B1Method and apparatus for separating non-metallic materialsAPPLIED PHOTONICS INC·Filed 2000·Granted Dec 3, 2002·149 cites·17 claims
- 0393US6420678B1Method for separating non-metallic substratesFiled 1999·Granted Jul 16, 2002·210 cites·18 claims
- 0493US6259058B1Apparatus for separating non-metallic substratesACCUDYNE DISPLAY AND SEMICONDU·Filed 1999·Granted Jul 10, 2001·182 cites·19 claims
- 0591US6252197B1Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicatorACCUDYNE DISPLAY AND SEMICONDU·Filed 1999·Granted Jun 26, 2001·223 cites·9 claims
- 0685US6660963B2Method and apparatus for separating non-metallic materialsAPPLIED PHOTONICS INC·Filed 2002·Granted Dec 9, 2003·36 cites·20 claims
- 0746US2007284785A1Device, System and Method for Cutting, Cleaving or Separating a Substrate MaterialTORAY ENG CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →