Inventor · disambiguated record
Brian C. Horsfield
Also filed as: HORSFIELD BRIAN C · MUISE JR LEGAL REPRESENTATIVE
4 granted patents·4 pending applications·67 citations·filing 1999–2007
77Inventor score
Top patents by PatentIndex Score
8 records- 0178US7384497B2Process for encapsulation of cellulose based substrates using electromagnetic radiation heatingWEYERHAEUSER CO·Filed 2004·Granted Jun 10, 2008·16 cites·16 claims
- 0277US6318046B1Engineered wood memberWEYERHAEUSER CO·Filed 1999·Granted Nov 20, 2001·36 cites·7 claims
- 0367US6635141B2Engineered wood member and method of its manufactureWEYERHAEUSER CO·Filed 2001·Granted Oct 21, 2003·13 cites·7 claims
- 0455US7247216B2Process for encapsulation of cellulose based substrate using non-electromagnetic heatingWEYERHAEUSER CO·Filed 2004·Granted Jul 24, 2007·2 cites·14 claims
- 0554US2007151685A1Cellulose-based substrates encapsulated with polymeric films and adhesiveWEYERHAEUSER CO·Filed 2007·Application pending·0 cites
- 0648US2005287321A1Cellulose based substrates encapsulated with polymeric films and adhesiveHORSFIELD BRIAN C·Filed 2004·Application pending·0 cites
- 0742US2005284564A1Process for encapsulation of cellulose based substrates using adhesiveHORSFIELD BRIAN C·Filed 2004·Application pending·0 cites
- 0835US2008236349A1Trim device for a lamination assemblyWEYERHAEUSER CO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →