Inventor · disambiguated record
Brian R. Hutchison
Also filed as: HUTCHISON BRIAN R
4 granted patents·1 pending application·207 citations·filing 1997–2019
79Inventor score
Top patents by PatentIndex Score
5 records- 0194US6137693AHigh-frequency electronic package with arbitrarily-shaped interconnects and integral shieldingAGILENT TECHNOLOGIES INC·Filed 1998·Granted Oct 24, 2000·138 cites·13 claims
- 0281US6414847B1Integral dielectric heatspreaderAGILENT TECHNOLOGIES INC·Filed 2001·Granted Jul 2, 2002·34 cites·19 claims
- 0364US6061251ALead-frame based vertical interconnect packageHEWLETT PACKARD CO·Filed 1997·Granted May 9, 2000·35 cites·13 claims
- 0444US10750617B2Bond-free interconnect between a microcircuit housing and a printed circuit assemblyKEYSIGHT TECHNOLOGIES INC·Filed 2019·Granted Aug 18, 2020·0 cites·17 claims
- 0533US2009059540A1Shielded high-frequency circuit moduleGIBONEY KIRK S·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →