Inventor · disambiguated record
Brandon C. Marin
Also filed as: MARIN BRANDON · MARIN BRANDON C · MARIN BRANDON CHRISTIAN
49 granted patents·210 pending applications·19 citations·filing 2012–2025
96Inventor score
Files withINTEL CORP253ALUR AMRUTHAVALLI PALLAVI1CALIFORNIA INST OF TECHN1ECTON JEREMY D1RICHE CARSON1
Top patents by PatentIndex Score
259 records- 0188US11158444B2Magnetic material having coated ferromagnetic filler particlesINTEL CORP·Filed 2018·Granted Oct 26, 2021·6 cites·22 claims
- 0285US12422615B2Nested glass packaging architecture for hybrid electrical and optical communication devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·11 claims
- 0383US12224103B2Angled inductor with small form factorINTEL CORP·Filed 2021·Granted Feb 11, 2025·1 cites·9 claims
- 0482US12282174B2Converting multiple light signals into and out of a single wavelength with multiple polarizations to increase optical bandwidthINTEL CORP·Filed 2020·Granted Apr 22, 2025·1 cites·19 claims
- 0582US11081768B2Fabricating an RF filter on a semiconductor package using selective seedingINTEL CORP·Filed 2019·Granted Aug 3, 2021·2 cites·21 claims
- 0680US12230564B2Package substrate z-disaggregation with liquid metal interconnectsINTEL CORP·Filed 2021·Granted Feb 18, 2025·1 cites·25 claims
- 0779US2025317206A1Embedded faraday rotators and components for increasing bandwidth and/or reducing fiber count in photonics multi chip packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 0875US11791228B2Method for forming embedded grounding planes on interconnect layersINTEL CORP·Filed 2019·Granted Oct 17, 2023·2 cites·17 claims
- 0974US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 1073US9913603B2Reflowed gold nanostructures for surface enhanced raman spectroscopyCALIFORNIA INST OF TECHN·Filed 2015·Granted Mar 13, 2018·2 cites·41 claims
- 1172US11737208B2Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2019·Granted Aug 22, 2023·1 cites·13 claims
- 1270US2024243088A1Copperless regions to control plating growthINTEL CORP·Filed 2024·Application pending·0 cites
- 1369US11804420B2Core-shell particles for magnetic packagingINTEL CORP·Filed 2018·Granted Oct 31, 2023·1 cites·7 claims
- 1469US10546916B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2018·Granted Jan 28, 2020·1 cites·9 claims
- 1569US2023345621A1Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2023·Application pending·0 cites
- 1667US12498520B2Integrated optical couplerINTEL CORP·Filed 2021·Granted Dec 16, 2025·0 cites·23 claims
- 1767US11605867B2Fabricating an RF filter on a semiconductor package using selective seedingINTEL CORP·Filed 2021·Granted Mar 14, 2023·0 cites·20 claims
- 1866US12412868B2Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 1966US11728077B2Magnetic material having coated ferromagnetic filler particlesINTEL CORP·Filed 2021·Granted Aug 15, 2023·0 cites·22 claims
- 2066US11652071B2Electronic device package including a capacitorINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·5 claims
- 2164US12444672B2Hybrid bonding technologies with thermal expansion compensation structuresINTEL CORP·Filed 2022·Granted Oct 14, 2025·0 cites·19 claims
- 2264US12368511B2Embedded faraday rotators and components for increasing bandwidth and/or reducing fiber count in photonics multi chip packagesINTEL CORP·Filed 2020·Granted Jul 22, 2025·0 cites·11 claims
- 2364US12306480B2Glass interposer optical resonator device and methodINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·15 claims
- 2463US12353070B2Glass interposer optical switching device and methodINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·15 claims
- 2563US11296186B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 5, 2022·0 cites·12 claims
- 2663US2025022908A1Micro light emitting diode structures formed in a recess of a transparent substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 2762US2025006570A1Glass cores including multiple layers and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 2861US12313890B2Through-substrate optical viasINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·20 claims
- 2961US12253722B2Magneto-optical Kerr effect interconnects for photonic packagingINTEL CORP·Filed 2021·Granted Mar 18, 2025·0 cites·13 claims
- 3061US12057252B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Granted Aug 6, 2024·0 cites·11 claims
- 3161US2024355749A1Disaggregated package substrates with glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 3261US2025022786A1Methods and apparatus for edge protected glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 3361US2024347402A1Methods and apparatus to reduce delamination in hybrid coresINTEL CORP·Filed 2024·Application pending·0 cites
- 3461US2024355758A1Methods and apparatus to reduce stress between sockets and associated integrated circuit packages having glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 3561US2025309145A1Stacked circuit component devices embedded in package substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 3661US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 3761US2025309149A1Microelectronic structures including embedded etch stop in package coreINTEL CORP·Filed 2024·Application pending·0 cites
- 3860US2025391716A1Riveted edge core for semiconductor packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 3959US2025218965A1Self alignment structures for interconnect bridgesINTEL CORP·Filed 2023·Application pending·0 cites
- 4059US2025391718A1Integrated circuit packages including substrates with reinforced glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 4159US2025132264A1Glass cores with embedded power delivery componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 4259US2025218982A1Technologies for ceramic components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 4359US2025149455A1Integrated circuit packages including glass-cored substrates with self-aligned through glass viasINTEL CORP·Filed 2023·Application pending·0 cites
- 4459US2024038735A1Micro light emitting diode structures for efficient communication of an optical signalINTEL CORP·Filed 2023·Application pending·0 cites
- 4559US2025210495A1Microelectronic assemblies with selective metallization for glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 4659US2024105571A1Implantation of species on glass core surface for low loss and high strength applicationsINTEL CORP·Filed 2022·Application pending·0 cites
- 4759US2025218905A1Component coupled with conductive vias encapsulated in an electronic substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 4859US2025309015A1Integrated circuit packages including a glass-core substrate with ultra-high aspect ratio through-glass viasINTEL CORP·Filed 2024·Application pending·0 cites
- 4959US2025300086A1Optical and electrical glass interposer with embedded bridgeINTEL CORP·Filed 2024·Application pending·0 cites
- 5059US2025300088A1Integrated circuit packages including interposers having a glass layer and embedded diesINTEL CORP·Filed 2024·Application pending·0 cites
Showing the top 50 of 259 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →