Inventor · disambiguated record
Brice Mcpherson
Also filed as: MCPHERSON BRICE · MCPHERSON BRICE A
52 granted patents·12 pending applications·293 citations·filing 1999–2024
98Inventor score
Files withWOLFSPEED INC36CREE FAYETTEVILLE INC16MITCHELL DAVID J6ARKANSAS POWER ELECTRONICS INT INC4SIEMENS ENERGY INC1
Top patents by PatentIndex Score
64 records- 0196US11696417B2High power multilayer module having low inductance and fast switching for paralleling power devicesWOLFSPEED INC·Filed 2022·Granted Jul 4, 2023·4 cites·19 claims
- 0295US10917992B2High power multilayer module having low inductance and fast switching for paralleling power devicesCREE FAYETTEVILLE INC·Filed 2019·Granted Feb 9, 2021·14 cites·30 claims
- 0395US10749443B2High power multilayer module having low inductance and fast switching for paralleling power devicesCREE FAYETTEVILLE INC·Filed 2019·Granted Aug 18, 2020·10 cites·27 claims
- 0494US11887953B2Package for power electronicsWOLFSPEED INC·Filed 2021·Granted Jan 30, 2024·2 cites·22 claims
- 0594US11756910B2Package for power electronicsWOLFSPEED INC·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 0694US11069640B2Package for power electronicsCREE FAYETTEVILLE INC·Filed 2019·Granted Jul 20, 2021·9 cites·20 claims
- 0794US9426883B2Low profile, highly configurable, current sharing paralleled wide band gap power device power moduleARKANSAS POWER ELECTRONICS INT INC·Filed 2015·Granted Aug 23, 2016·21 cites·18 claims
- 0893US12224218B2Semiconductor packages with increased power handlingWOLFSPEED INC·Filed 2022·Granted Feb 11, 2025·4 cites·33 claims
- 0992US8023269B2Wireless telemetry electronic circuit board for high temperature environmentsSIEMENS ENERGY INC·Filed 2008·Granted Sep 20, 2011·20 cites·1 claims
- 1091US11721617B2Power moduleWOLFSPEED INC·Filed 2021·Granted Aug 8, 2023·2 cites·28 claims
- 1191US10405450B2High power multilayer module having low inductance and fast switching for paralleling power devicesCREE FAYETTEVILLE INC·Filed 2019·Granted Sep 3, 2019·7 cites·24 claims
- 1291US9095054B1High temperature equalized electrical parasitic power packaging method for many paralleled semiconductor power devicesARKANSAS POWER ELECTRONICS INT INC·Filed 2013·Granted Jul 28, 2015·19 cites·2 claims
- 1390US10212838B2High power multilayer module having low inductance and fast switching for paralleling power devicesCREE FAYETTEVILLE INC·Filed 2017·Granted Feb 19, 2019·6 cites·20 claims
- 1490US9275938B1Low profile high temperature double sided flip chip power packagingARKANSAS POWER ELECTRONICS INT INC·Filed 2013·Granted Mar 1, 2016·13 cites·20 claims
- 1589US8092080B2Wireless telemetry circuit structure for measuring temperature in high temperature environmentsMITCHELL DAVID J·Filed 2008·Granted Jan 10, 2012·17 cites·21 claims
- 1688US8223036B2Wireless telemetry electronic circuitry for measuring strain in high-temperature environmentsMITCHELL DAVID J·Filed 2008·Granted Jul 17, 2012·14 cites·17 claims
- 1787US12150258B2Dual inline power moduleWOLFSPEED INC·Filed 2022·Granted Nov 19, 2024·1 cites·37 claims
- 1887US10080301B2High voltage power chip moduleCREE FAYETTEVILLE INC·Filed 2014·Granted Sep 18, 2018·8 cites·21 claims
- 1986US8629783B2Wireless telemetry electronic circuitry for measuring strain in high-temperature environmentsMITCHELL DAVID J·Filed 2012·Granted Jan 14, 2014·9 cites·20 claims
- 2084US10784235B2Silicon carbide power moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Sep 22, 2020·4 cites·18 claims
- 2184US9967977B1Step etched metal electrical contactsARKANSAS POWER ELECTRONICS INT INC·Filed 2014·Granted May 8, 2018·5 cites·20 claims
- 2283US12446180B2High power multilayer module having low inductance and fast switching for paralleling power devicesWOLFSPEED INC·Filed 2024·Granted Oct 14, 2025·0 cites·23 claims
- 2383US12400986B2Package for power electronicsWOLFSPEED INC·Filed 2023·Granted Aug 26, 2025·0 cites·27 claims
- 2483US11445630B2High power multilayer module having low inductance and fast switching for paralleling power devicesWOLFSPEED INC·Filed 2021·Granted Sep 13, 2022·1 cites·20 claims
- 2583USD903590SPower moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Dec 1, 2020·15 cites·1 claims
- 2683US8458899B2Method for manufacturing a circuit for high temperature and high g-force environmentsMITCHELL DAVID J·Filed 2011·Granted Jun 11, 2013·5 cites·6 claims
- 2782US8220990B2Wireless telemetry electronic circuit package for high temperature environmentsMITCHELL DAVID J·Filed 2008·Granted Jul 17, 2012·9 cites·20 claims
- 2881USD954668SHousing for a power module assemblyWOLFSPEED INC·Filed 2019·Granted Jun 14, 2022·19 cites·1 claims
- 2980US12199071B2Compact power moduleWOLFSPEED INC·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 3080USD969740SPower moduleCREE FAYETTEVILLE INC·Filed 2020·Granted Nov 15, 2022·5 cites·1 claims
- 3180US10136529B2Low profile, highly configurable, current sharing paralleled wide band gap power device power moduleCREE FAYETTEVILLE INC·Filed 2016·Granted Nov 20, 2018·3 cites·28 claims
- 3280US8525036B2Wireless telemetry electronic circuit board for high temperature environmentsMITCHELL DAVID J·Filed 2011·Granted Sep 3, 2013·4 cites·7 claims
- 3379USD985517SPower module having pin finsWOLFSPEED INC·Filed 2021·Granted May 9, 2023·5 cites·1 claims
- 3479US2025112211A1Compact power moduleWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 3577US12159909B2Power semiconductor device with reduced strainWOLFSPEED INC·Filed 2023·Granted Dec 3, 2024·0 cites·18 claims
- 3677US6203811B1Termite control compositionsUNIV CALIFORNIA·Filed 1999·Granted Mar 20, 2001·22 cites·19 claims
- 3777US2024395677A1Power ModuleWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 3876US12080635B2Power moduleWOLFSPEED INC·Filed 2023·Granted Sep 3, 2024·0 cites·21 claims
- 3974US2025056738A1Dual inline power moduleWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 4070USD1036395SPower moduleWOLFSPEED INC·Filed 2022·Granted Jul 23, 2024·2 cites·1 claims
- 4169US11923344B2Compact power moduleWOLFSPEED INC·Filed 2021·Granted Mar 5, 2024·0 cites·29 claims
- 4267US12010823B2High power multilayer module having low inductance and fast switching for paralleling power devicesCREE FAYETTEVILLE INC·Filed 2020·Granted Jun 11, 2024·0 cites·35 claims
- 4367US11869948B2Power semiconductor device with reduced strainWOLFSPEED INC·Filed 2021·Granted Jan 9, 2024·0 cites·31 claims
- 4467USD942403SPower module having pin finsCREE FAYETTEVILLE INC·Filed 2019·Granted Feb 1, 2022·7 cites·1 claims
- 4565US2025081579A1Metallizations for semiconductor power devicesWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 4660US12374660B2Power moduleWOLFSPEED INC·Filed 2022·Granted Jul 29, 2025·0 cites·25 claims
- 4759USD1041429SPower module having pin finsWOLFSPEED INC·Filed 2023·Granted Sep 10, 2024·1 cites·1 claims
- 4859US2025201674A1Engineered Interconnect Structures for Enhanced Bonding StrengthWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 4958US11984433B2Arrangements of power semiconductor devices for improved thermal performanceWOLFSPEED INC·Filed 2021·Granted May 14, 2024·0 cites·33 claims
- 5057US2025300105A1Power devices with multiple metal layer thicknessesWOLFSPEED INC·Filed 2024·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →