Inventor · disambiguated record
Brennen Mueller
Also filed as: MUELLER BRENNEN · MUELLER BRENNEN K · MUELLER BRENNEN KARL
20 granted patents·7 pending applications·47 citations·filing 2011–2024
92Inventor score
Top patents by PatentIndex Score
27 records- 0198US11594524B2Fabrication and use of through silicon vias on double sided interconnect deviceINTEL CORP·Filed 2022·Granted Feb 28, 2023·6 cites·20 claims
- 0296US11527501B1Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 13, 2022·7 cites·11 claims
- 0395US12176323B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Dec 24, 2024·2 cites·12 claims
- 0495US11990516B1Quantum dot devices with independent gate controlINTEL CORP·Filed 2021·Granted May 21, 2024·4 cites·20 claims
- 0591US11251156B2Fabrication and use of through silicon vias on double sided interconnect deviceINTEL CORP·Filed 2015·Granted Feb 15, 2022·8 cites·20 claims
- 0689US11922274B1Quantum dot devices with side and center screening gatesINTEL CORP·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 0785US11056356B1Fluid viscosity control during wafer bondingINTEL CORP·Filed 2018·Granted Jul 6, 2021·5 cites·9 claims
- 0884US11348897B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 31, 2022·3 cites·7 claims
- 0982US11189585B2Selective recess of interconnects for probing hybrid bond devicesINTEL CORP·Filed 2019·Granted Nov 30, 2021·3 cites·17 claims
- 1081US2025070083A1Microelectronic assembliesINTEL CORP·Filed 2024·Application pending·0 cites
- 1180US10720345B1Wafer to wafer bonding with low wafer distortionINTEL CORP·Filed 2018·Granted Jul 21, 2020·3 cites·13 claims
- 1277US11393777B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted Jul 19, 2022·2 cites·18 claims
- 1376US11721554B2Stress compensation for wafer to wafer bondingINTEL CORP·Filed 2019·Granted Aug 8, 2023·2 cites·16 claims
- 1471US11721649B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Aug 8, 2023·0 cites·11 claims
- 1566US11749628B2Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2022·Granted Sep 5, 2023·0 cites·15 claims
- 1665US11887887B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2022·Granted Jan 30, 2024·0 cites·18 claims
- 1755US11404307B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2019·Granted Aug 2, 2022·0 cites·18 claims
- 1855US9740096B2Positive-tone, chemically amplified, aqueous-developable, permanent dielectricGEORGIA TECH RES INST·Filed 2013·Granted Aug 22, 2017·0 cites·41 claims
- 1952US2023197732A1Integrated group iii-nitrogen and silicon transistors on the same dieINTEL CORP·Filed 2021·Application pending·0 cites
- 2050US2023187395A1Oxide and carbon layers at a surface of a substrate for hybrid bondingINTEL CORP·Filed 2021·Application pending·0 cites
- 2147US11532719B2Transistors on heterogeneous bonding layersINTEL CORP·Filed 2018·Granted Dec 20, 2022·0 cites·18 claims
- 2246US11605565B2Three dimensional integrated circuits with stacked transistorsINTEL CORP·Filed 2018·Granted Mar 14, 2023·0 cites·20 claims
- 2346US11532558B2Metallization barrier structures for bonded integrated circuit interfacesINTEL CORP·Filed 2019·Granted Dec 20, 2022·0 cites·20 claims
- 2443US2021407996A1Gate-all-around integrated circuit structures having strained dual nanoribbon channel structuresAGRAWAL ASHISH·Filed 2020·Application pending·0 cites
- 2540US2020212038A1Self-aligned stacked ge/si cmos transistor structureINTEL CORP·Filed 2018·Application pending·0 cites
- 2636US2019057950A1Permanent functional carrier systems and methodsINTEL CORP·Filed 2016·Application pending·0 cites
- 2732US2013196019A1Silicon-containing block co-polymers, methods for synthesis and useWILLSON C GRANT·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →