Inventor · disambiguated record
Bruce A. Myers
Also filed as: MYERS BRUCE A · MYERS BRUCE ALAN
42 granted patents·10 pending applications·1,526 citations·filing 1988–2015
98Inventor score
Top patents by PatentIndex Score
52 records- 0198US7307841B2Electronic package and method of cooling electronicsDELPHI TECH INC·Filed 2005·Granted Dec 11, 2007·89 cites·21 claims
- 0297US7551439B2Fluid cooled electronic assemblyDELPHI TECH INC·Filed 2006·Granted Jun 23, 2009·106 cites·17 claims
- 0395US7365981B2Fluid-cooled electronic systemDELPHI TECH INC·Filed 2005·Granted Apr 29, 2008·48 cites·8 claims
- 0495US7334243B2Vane integration into motor hub to enhance CD coolingDELPHI TECH INC·Filed 2005·Granted Feb 19, 2008·26 cites·21 claims
- 0594US7215547B2Integrated cooling system for electronic devicesDELPHI TECH INC·Filed 2004·Granted May 8, 2007·87 cites·31 claims
- 0694US6807731B2Method for forming an electronic assemblyDELPHI TECH INC·Filed 2002·Granted Oct 26, 2004·65 cites·14 claims
- 0793US8480798B1Vehicle system to separate and store carbon dioxide from engine exhaustMYERS BRUCE A·Filed 2010·Granted Jul 9, 2013·22 cites·6 claims
- 0893US7608924B2Liquid cooled power electronic circuit comprising stacked direct die cooled packagesDELPHI TECH INC·Filed 2007·Granted Oct 27, 2009·33 cites·12 claims
- 0993US6156980AFlip chip on circuit board with enhanced heat dissipation and method thereforDELCO ELECTRONICS CORP·Filed 1998·Granted Dec 5, 2000·149 cites·20 claims
- 1092US7294926B2Chip cooling systemDELPHI TECH INC·Filed 2005·Granted Nov 13, 2007·25 cites·12 claims
- 1192US6779260B1Overmolded electronic package including circuit-carrying substrateDELPHI TECH INC·Filed 2003·Granted Aug 24, 2004·71 cites·32 claims
- 1290US7538425B2Power semiconductor package having integral fluid coolingDELPHI TECH INC·Filed 2004·Granted May 26, 2009·74 cites·7 claims
- 1390US6822018B2Thermally-conductive electrically-insulating polymer-base materialDELPHI TECH INC·Filed 2002·Granted Nov 23, 2004·27 cites·20 claims
- 1489US7795726B2Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chipsDELPHI TECH INC·Filed 2007·Granted Sep 14, 2010·21 cites·7 claims
- 1589US7118940B1Method of fabricating an electronic package having underfill standoffDELPHI TECH INC·Filed 2005·Granted Oct 10, 2006·20 cites·17 claims
- 1688US7269017B2Thermal management of surface-mount circuit devices on laminate ceramic substrateDELPHI TECH INC·Filed 2004·Granted Sep 11, 2007·45 cites·20 claims
- 1787US5400950AMethod for controlling solder bump height for flip chip integrated circuit devicesDELCO ELECTRONICS CORP·Filed 1994·Granted Mar 28, 1995·125 cites·9 claims
- 1885US7561436B2Circuit assembly with surface-mount IC package and heat sinkDELPHI TECH INC·Filed 2005·Granted Jul 14, 2009·14 cites·4 claims
- 1983US7132746B2Electronic assembly with solder-bonded heat sinkDELPHI TECH INC·Filed 2003·Granted Nov 7, 2006·35 cites·16 claims
- 2083US6535396B1Combination circuit board and segmented conductive bus substrateDELPHI TECH INC·Filed 2000·Granted Mar 18, 2003·36 cites·13 claims
- 2182US4894015AFlexible circuit interconnector and method of assembly thereofDELCO ELECTRONICS CORP·Filed 1988·Granted Jan 16, 1990·60 cites·10 claims
- 2281US7782616B1Heat-dissipating component having stair-stepped coolant channelsDELPHI TECH INC·Filed 2009·Granted Aug 24, 2010·12 cites·7 claims
- 2380US6703128B2Thermally-capacitive phase change encapsulant for electronic devicesDELPHI TECH INC·Filed 2002·Granted Mar 9, 2004·31 cites·20 claims
- 2480US5151777AInterface device for thermally coupling an integrated circuit to a heat sinkDELCO ELECTRONICS CORP·Filed 1989·Granted Sep 29, 1992·61 cites·6 claims
- 2579US5395679AUltra-thick thick films for thermal management and current carrying capabilities in hybrid circuitsDELCO ELECTRONICS CORP·Filed 1993·Granted Mar 7, 1995·65 cites·13 claims
- 2678US8438862B2Thermally-protected chamber for a temperature-sensitive consumer electronic deviceOMAN TODD P·Filed 2009·Granted May 14, 2013·8 cites·8 claims
- 2776US9267415B2Heat exchanger equipped with thermal electric device for engine exhaust carbon dioxide collection systemDELPHI TECH INC·Filed 2013·Granted Feb 23, 2016·5 cites·15 claims
- 2875US6560110B1Corrosive resistant flip chip thermal management structureDELPHI TECH INC·Filed 2002·Granted May 6, 2003·19 cites·26 claims
- 2973US7321098B2Laminate ceramic circuit board and process thereforDELPHI TECH INC·Filed 2004·Granted Jan 22, 2008·20 cites·10 claims
- 3073US6693239B2Overmolded circuit board with underfilled surface-mount component and method thereforDELPHI TECH INC·Filed 2001·Granted Feb 17, 2004·21 cites·34 claims
- 3171US7106588B2Power electronic system with passive coolingDELPHI TECH INC·Filed 2003·Granted Sep 12, 2006·18 cites·21 claims
- 3270US8696804B2Carbon dioxide absorbent fluid for a carbon dioxide sequestering system on a vehicleDELPHI TECH INC·Filed 2013·Granted Apr 15, 2014·2 cites·2 claims
- 3358US7094975B2Circuit board with localized stiffener for enhanced circuit component reliabilityDELPHI TECH INC·Filed 2003·Granted Aug 22, 2006·8 cites·18 claims
- 3454US7352070B2Polymer encapsulated electrical devicesDELPHI TECH INC·Filed 2003·Granted Apr 1, 2008·8 cites·11 claims
- 3553US7498376B2Thermal transient suppression material and method of productionDELPHI TECH INC·Filed 2004·Granted Mar 3, 2009·5 cites·12 claims
- 3653US5334422AElectrical connector having energy-formed solder stops and methods of making and using the sameDELCO ELECTRONICS CORP·Filed 1993·Granted Aug 2, 1994·20 cites·12 claims
- 3752US2005137286A1Thermally-conductive electrically-insulating polymer-base materialDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 3849US2011080665A1Visual gap mitigation apparatus for a segmented display panelDELPHI TECH INC·Filed 2009·Application pending·0 cites
- 3947US7574793B2Process of forming a laminate ceramic circuit boardDELPHI TECH INC·Filed 2007·Granted Aug 18, 2009·0 cites·12 claims
- 4045US5322565AMethod and apparatus for through hole substrate printingDELCO ELECTRONICS CORP·Filed 1991·Granted Jun 21, 1994·17 cites·5 claims
- 4144US5482200AMethod for applying solder to a fine pitch flip chip patternDELCO ELECTRONICS CORP·Filed 1994·Granted Jan 9, 1996·12 cites·2 claims
- 4244US2014305480A1Thermoelectric generator to engine exhaust manifold assemblyDELPHI TECH INC·Filed 2013·Application pending·0 cites
- 4342US2005081377A1Method for forming an electronic assemblyDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 4440US2006209516A1Electronic assembly with integral thermal transient suppressionCHENGALVA SURESH K·Filed 2005·Application pending·0 cites
- 4540US2008290378A1Transistor package with wafer level dielectric isolationMYERS BRUCE A·Filed 2007·Application pending·0 cites
- 4638US6979900B2Integrated circuit package with integral leadframe convector and method thereforDELPHI TECH INC·Filed 2003·Granted Dec 27, 2005·0 cites·18 claims
- 4738US5080929AMethod and apparatus for through hole substrate printingDELCO ELECTRONICS CORP·Filed 1990·Granted Jan 14, 1992·11 cites·4 claims
- 4838US2006021792A1Surface mount axial leaded component for an electronic moduleMYERS BRUCE A·Filed 2004·Application pending·0 cites
- 4938US2014305481A1Thermoelectric generator to engine exhaust manifold assemblyDELPHI TECH INC·Filed 2013·Application pending·0 cites
- 5037US2005018402A1Thermally enhanced electronic moduleFiled 2003·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →