Inventor · disambiguated record
Brigham Navaja
Also filed as: NAVAJA BRIGHAM
5 granted patents·7 pending applications·0 citations·filing 2018–2023
58Inventor score
Files withQUALCOMM INC12
Top patents by PatentIndex Score
12 records- 0156US11177223B1Electromagnetic interference shielding for packages and modulesQUALCOMM INC·Filed 2020·Granted Nov 16, 2021·0 cites·22 claims
- 0255US2024321709A1Package comprising an integrated device and a metallization portion with variable thickness metallization interconnects on a same metal layerQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0353US2024304503A1Split pad with test lineQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0451US11552023B2Passive component embedded in an embedded trace substrate (ETS)QUALCOMM INC·Filed 2020·Granted Jan 10, 2023·0 cites·16 claims
- 0546US11948877B2Hybrid package apparatus and method of fabricatingQUALCOMM INC·Filed 2021·Granted Apr 2, 2024·0 cites·24 claims
- 0646US11581262B2Package comprising a die and die side redistribution layers (RDL)QUALCOMM INC·Filed 2019·Granted Feb 14, 2023·0 cites·30 claims
- 0746US10804195B2High density embedded interconnects in substrateQUALCOMM INC·Filed 2018·Granted Oct 13, 2020·0 cites·24 claims
- 0846US2023035627A1Split die integrated circuit (ic) packages employing die-to-die (d2d) connections in die-substrate standoff cavity, and related fabrication methodsQUALCOMM INC·Filed 2021·Application pending·0 cites
- 0943US2021296280A1Stacked module package interconnect structure with flex cableQUALCOMM INC·Filed 2020·Application pending·0 cites
- 1043US2021407919A1Hybrid metallization and laminate structureQUALCOMM INC·Filed 2020·Application pending·0 cites
- 1140US2020176417A1Stacked embedded passive substrate structureQUALCOMM INC·Filed 2018·Application pending·0 cites
- 1240US2020111758A1Spilt pad for package routing and electrical performance improvementQUALCOMM INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →