Inventor · disambiguated record
Brandon Passmore
Also filed as: PASSMORE BRANDON · PASSMORE BRANDON SCOTT
19 granted patents·6 pending applications·131 citations·filing 2010–2024
94Inventor score
Files withWOLFSPEED INC10CREE FAYETTEVILLE INC8ARKANSAS POWER ELECTRONICS INT INC3BRENER IGAL1CREE INC1
Top patents by PatentIndex Score
25 records- 0194US9839146B2High voltage power moduleCREE INC·Filed 2015·Granted Dec 5, 2017·10 cites·20 claims
- 0294US9426883B2Low profile, highly configurable, current sharing paralleled wide band gap power device power moduleARKANSAS POWER ELECTRONICS INT INC·Filed 2015·Granted Aug 23, 2016·21 cites·18 claims
- 0393US9407251B1Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integrationARKANSAS POWER ELECTRONICS INT INC·Filed 2013·Granted Aug 2, 2016·29 cites·4 claims
- 0492US10448524B2High voltage power moduleCREE FAYETTEVILLE INC·Filed 2017·Granted Oct 15, 2019·6 cites·15 claims
- 0591US11721617B2Power moduleWOLFSPEED INC·Filed 2021·Granted Aug 8, 2023·2 cites·28 claims
- 0690US9275938B1Low profile high temperature double sided flip chip power packagingARKANSAS POWER ELECTRONICS INT INC·Filed 2013·Granted Mar 1, 2016·13 cites·20 claims
- 0790US9018642B1Mid-infrared tunable metamaterialsSANDIA CORP·Filed 2012·Granted Apr 28, 2015·13 cites·8 claims
- 0887US10080301B2High voltage power chip moduleCREE FAYETTEVILLE INC·Filed 2014·Granted Sep 18, 2018·8 cites·21 claims
- 0987US9705311B1Mid-infrared tunable metamaterialsBRENER IGAL·Filed 2010·Granted Jul 11, 2017·10 cites·9 claims
- 1084US10784235B2Silicon carbide power moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Sep 22, 2020·4 cites·18 claims
- 1180US10136529B2Low profile, highly configurable, current sharing paralleled wide band gap power device power moduleCREE FAYETTEVILLE INC·Filed 2016·Granted Nov 20, 2018·3 cites·28 claims
- 1277US2024395677A1Power ModuleWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1376US12080635B2Power moduleWOLFSPEED INC·Filed 2023·Granted Sep 3, 2024·0 cites·21 claims
- 1475US10750627B2High voltage power moduleCREE FAYETTEVILLE INC·Filed 2019·Granted Aug 18, 2020·1 cites·31 claims
- 1571US11206740B2High voltage power moduleCREE FAYETTEVILLE INC·Filed 2020·Granted Dec 21, 2021·0 cites·22 claims
- 1667USD908632SPower moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Jan 26, 2021·10 cites·1 claims
- 1759US2025201674A1Engineered Interconnect Structures for Enhanced Bonding StrengthWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1858US11984433B2Arrangements of power semiconductor devices for improved thermal performanceWOLFSPEED INC·Filed 2021·Granted May 14, 2024·0 cites·33 claims
- 1957US2025300105A1Power devices with multiple metal layer thicknessesWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 2056USD909310SPower moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Feb 2, 2021·0 cites·1 claims
- 2154US2024213124A1Power electronics package layouts, structures, and/or configurations for one or more power devices and processes implementing the sameWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 2252US2025149395A1Power modules having encapsulation stress and strain mitigating configurationsWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2350USD1073632SPower moduleWOLFSPEED INC·Filed 2021·Granted May 6, 2025·1 cites·1 claims
- 2450US2025014973A1Power package configured with additional functionalityWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2538US9761506B2Semiconductor device and fabrication method for the sameOTSUKA TAKUKAZU·Filed 2012·Granted Sep 12, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →