Inventor · disambiguated record
Brian Roggeman
Also filed as: Roggeman Brian
1 granted patent·1 pending application·10 citations·filing 2016–2024
32Inventor score
Technology areasH10W
Files withQUALCOMM INC2
Top patents by PatentIndex Score
2 records- 0188US9947642B2Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packagesQUALCOMM INC·Filed 2016·Granted Apr 17, 2018·10 cites·24 claims
- 0257US2025379134A1Integrated circuit package comprising a substrate and a solder joint coupled to a corner interconnect structure of the substrate to improve the reliability of the packageQUALCOMM INC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →