Inventor · disambiguated record
Brian Ruchert
Also filed as: RUCHERT BRIAN D
0 granted patents·4 pending applications·0 citations·filing 2005–2007
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0138US2007013054A1Thermally conductive materials, solder preform constructions, assemblies and semiconductor packagesRUCHERT BRIAN D·Filed 2005·Application pending·0 cites
- 0235US2008296756A1Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereofKOCH JAMES L·Filed 2007·Application pending·0 cites
- 0329US2007051773A1Thermal interface materials, methods of preparation thereof and their applicationsRUCHERT BRIAN D·Filed 2005·Application pending·0 cites
- 0429US2007166554A1Thermal interconnect and interface systems, methods of production and uses thereofRUCHERT BRIAN D·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →