Inventor · disambiguated record
Brad D. Rumsey
Also filed as: RUMSEY BRAD D
32 granted patents·2 pending applications·763 citations·filing 1999–2006
98Inventor score
Top patents by PatentIndex Score
34 records- 0196US6415977B1Method and apparatus for marking and identifying a defective die siteMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 9, 2002·80 cites·63 claims
- 0295US6210992B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·172 cites·18 claims
- 0394US6668449B2Method of making a semiconductor device having an opening in a solder maskMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 30, 2003·63 cites·26 claims
- 0493US6365434B1Method and apparatus for reduced flash encapsulation of microelectronic devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 2, 2002·67 cites·54 claims
- 0592US6577004B1Solder ball landpad design to improve laminate performanceMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·75 cites·46 claims
- 0691US6644949B2Apparatus for reduced flash encapsulation of microelectronic devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 11, 2003·51 cites·29 claims
- 0791US6638595B2Method and apparatus for reduced flash encapsulation of microelectronic devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 28, 2003·52 cites·13 claims
- 0883US6889902B2Descriptor for identifying a defective die site and methods of formationMICRON TECHNOLOGY INC·Filed 2002·Granted May 10, 2005·20 cites·10 claims
- 0981US6521980B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·25 cites·12 claims
- 1081US6518678B2Apparatus and method for reducing interposer compression during molding processMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 11, 2003·26 cites·53 claims
- 1170US7307850B2Soldermask opening to prevent delaminationMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 11, 2007·3 cites·35 claims
- 1270US7146720B2Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducialMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 12, 2006·10 cites·18 claims
- 1369US7255273B2Descriptor for identifying a defective die siteMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 14, 2007·8 cites·6 claims
- 1468US6473311B1Gate area relief strip for a molded I/C packageMICRO TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·13 cites·39 claims
- 1567US7127365B2Method for identifying a defective die siteMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 24, 2006·7 cites·11 claims
- 1666US6914326B2Solder ball landpad design to improve laminate performanceMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 5, 2005·11 cites·24 claims
- 1765US6395579B2Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 2001·Granted May 28, 2002·10 cites·9 claims
- 1862US6356452B1Soldermask opening to prevent delaminationMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 12, 2002·14 cites·40 claims
- 1960US7335571B2Method of making a semiconductor device having an opening in a solder maskMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 26, 2008·5 cites·54 claims
- 2060US6984894B2Semiconductor package having a partial slot cover for encapsulation processMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 10, 2006·6 cites·17 claims
- 2159US7019223B2Solder resist opening to define a combination pin one indicator and fiducialMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 28, 2006·5 cites·22 claims
- 2259US7013559B2Method of fabricating a semiconductor device packageMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 21, 2006·5 cites·27 claims
- 2358US6634099B2Soldermask opening to prevent delaminationMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 21, 2003·4 cites·34 claims
- 2457US7115819B1Positioning flowable solder for bonding integrated circuit elementsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 3, 2006·15 cites·12 claims
- 2557US6690086B2Apparatus and method for reducing interposer compression during molding processMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 10, 2004·6 cites·24 claims
- 2655US7088590B2Soldermask opening to prevent delaminationMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 8, 2006·3 cites·23 claims
- 2752US6790708B2Encapsulation process using a partial slot cover and a package formed by the processMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 14, 2004·3 cites·15 claims
- 2852US6671182B2Soldermask opening to prevent delaminationMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 30, 2003·2 cites·48 claims
- 2952US2006283915A1Positioning flowable solder for bonding integrated circuit elementsRUMSEY BRAD D·Filed 2006·Application pending·0 cites
- 3049US2006049531A1Semiconductor package having a partial slot cover for encapsulation processRUMSEY BRAD D·Filed 2005·Application pending·0 cites
- 3147US6734372B2Gate area relief strip for a molded I/C packageMICRON TECHNOLOGY INC·Filed 2002·Granted May 11, 2004·2 cites·33 claims
- 3244US7263768B2Method of making a semiconductor device having an opening in a solder maskMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 4, 2007·0 cites·52 claims
- 3340US6577015B1Partial slot cover for encapsulation processMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·0 cites·20 claims
- 3439US7951646B2Solder ball landpad design to improve laminate performanceROUND ROCK RES LLC·Filed 2003·Granted May 31, 2011·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →