Inventor · disambiguated record
Bret W. Simon
Also filed as: SIMON BRET · SIMON BRET W
12 granted patents·6 citations·filing 2013–2022
81Inventor score
Top patents by PatentIndex Score
12 records- 0180US11948855B1Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreaderROCKWELL COLLINS INC·Filed 2022·Granted Apr 2, 2024·1 cites·7 claims
- 0270US9589913B1Flip chip stacking utilizing interposerROCKWELL COLLINS INC·Filed 2013·Granted Mar 7, 2017·4 cites·14 claims
- 0362US10799211B2Sterile covers for ultrasound probeCIVCO MEDICAL INSTR CO INC·Filed 2015·Granted Oct 13, 2020·1 cites·4 claims
- 0459US11326246B2Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film depositionROCKWELL COLLINS INC·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 0556US11950955B2Sterile covers for ultrasound probeCIVCO MEDICAL INSTR CO INC·Filed 2020·Granted Apr 9, 2024·0 cites·10 claims
- 0654US11502060B2Microelectronics package with enhanced thermal dissipationROCKWELL COLLINS INC·Filed 2020·Granted Nov 15, 2022·0 cites·12 claims
- 0753US11621219B2Method and apparatus for through silicon die level interconnectROCKWELL COLLINS INC·Filed 2021·Granted Apr 4, 2023·0 cites·8 claims
- 0849US11515225B2Reconstituted wafer including mold material with recessed conductive featureROCKWELL COLLINS INC·Filed 2020·Granted Nov 29, 2022·0 cites·18 claims
- 0947US11637211B2Optically clear thermal spreader for status indication within an electronics packageROCKWELL COLLINS INC·Filed 2021·Granted Apr 25, 2023·0 cites·11 claims
- 1047US11605570B2Reconstituted wafer including integrated circuit die mechanically interlocked with mold materialROCKWELL COLLINS INC·Filed 2020·Granted Mar 14, 2023·0 cites·12 claims
- 1145US11276641B1Conformal multi-plane material depositionROCKWELL COLLINS INC·Filed 2020·Granted Mar 15, 2022·0 cites·11 claims
- 1238US10187987B1Interconnect assembly with flexible circuitROCKWELL COLLINS INC·Filed 2017·Granted Jan 22, 2019·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →