Inventor · disambiguated record
Brent Stone
Also filed as: STONE BRENT · STONE BRENT S
19 granted patents·5 pending applications·124 citations·filing 2000–2015
94Inventor score
Top patents by PatentIndex Score
24 records- 0189US10056182B2Surface-mount inductor structures for forming one or more inductors with substrate tracesINTEL CORP·Filed 2015·Granted Aug 21, 2018·7 cites·9 claims
- 0283US7429497B2Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication thereforINTEL CORP·Filed 2006·Granted Sep 30, 2008·10 cites·16 claims
- 0377US7053496B2Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation thereforINTEL CORP·Filed 2003·Granted May 30, 2006·22 cites·8 claims
- 0477US7014488B2Socket cover with recessed center and methodINTEL CORP·Filed 2004·Granted Mar 21, 2006·21 cites·11 claims
- 0570US7687905B2Integrated circuit packages, systems, and methodsINTEL CORP·Filed 2008·Granted Mar 30, 2010·4 cites·6 claims
- 0667US6979891B2Integrated circuit packaging architectureINTEL CORP·Filed 2003·Granted Dec 27, 2005·12 cites·14 claims
- 0762US7114959B2Land grid array with socket plateINTEL CORP·Filed 2004·Granted Oct 3, 2006·13 cites·35 claims
- 0862US6853061B2Dual power supply method and apparatusINTEL CORP·Filed 2002·Granted Feb 8, 2005·10 cites·13 claims
- 0961US7794236B2Land grid array (LGA) socket for various package sizesINTEL CORP·Filed 2008·Granted Sep 14, 2010·2 cites·17 claims
- 1060US9674954B2Chip package connector assemblyINTEL CORP·Filed 2013·Granted Jun 6, 2017·3 cites·17 claims
- 1152US6561820B2Socket planeINTEL CORP·Filed 2001·Granted May 13, 2003·8 cites·21 claims
- 1251US7339263B2Integrated circuit packages, systems, and methodsINTEL CORP·Filed 2004·Granted Mar 4, 2008·4 cites·19 claims
- 1347US7161243B2System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power deliveryINTEL CORP·Filed 2005·Granted Jan 9, 2007·0 cites·10 claims
- 1447US6713684B2Hole grid array package and socket technologyINTEL CORP·Filed 2001·Granted Mar 30, 2004·2 cites·27 claims
- 1546US6992378B2Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power deliveryINTEL CORP·Filed 2000·Granted Jan 31, 2006·2 cites·21 claims
- 1643US7220132B2Tilted land grid array package and socket, systems, and methodsINTEL CORP·Filed 2004·Granted May 22, 2007·0 cites·19 claims
- 1743US2014167900A1Surface-mount inductor structures for forming one or more inductors with substrate tracesMURTAGIAN GREGORIO R·Filed 2012·Application pending·0 cites
- 1842US6724077B2Semiconductor package having multi-signal bus barsINTEL CORP·Filed 2001·Granted Apr 20, 2004·2 cites·3 claims
- 1941US6710440B2Low resistance contact for an integrated circuitINTEL CORP·Filed 2002·Granted Mar 23, 2004·2 cites·16 claims
- 2039US2004056298A1Hole grid array package and socket technologyFiled 2003·Application pending·0 cites
- 2139US2004100780A1Motherboard power-levelerFiled 2002·Application pending·0 cites
- 2236US7034390B2Semiconductor package having multi-signal bus barsINTEL CORP·Filed 2003·Granted Apr 25, 2006·0 cites·24 claims
- 2336US2005127489A1Microelectronic device signal transmission by way of a lidFiled 2003·Application pending·0 cites
- 2429US2005073805A1Integrated circuit packageFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →