Inventor · disambiguated record
Bryan Tracy
Also filed as: TRACY BRYAN · TRACY BRYAN M · TRACY BRYAN MITCHELL
12 granted patents·1 pending application·236 citations·filing 1995–2025
92Inventor score
Top patents by PatentIndex Score
13 records- 0178US5847821AUse of fiducial marks for improved blank wafer defect reviewADVANCED MICRO DEVICES INC·Filed 1997·Granted Dec 8, 1998·51 cites·8 claims
- 0276US5770519ACopper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1995·Granted Jun 23, 1998·49 cites·19 claims
- 0371US5882738AApparatus and method to improve electromigration performance by use of amorphous barrier layerADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 16, 1999·42 cites·19 claims
- 0467US2025343437A1Battery backup system for fail-safe electric actuatorsMAX AIR TECH INC·Filed 2025·Application pending·0 cites
- 0557US5639691ACopper pellet for reducing electromigration effects associated with a conductive via in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1996·Granted Jun 17, 1997·19 cites·20 claims
- 0656US6812049B1Method and system for performing failure analysis on a multilayer silicon-on-insulator (SOI) deviceADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 2, 2004·7 cites·10 claims
- 0754US6011619ASemiconductor wafer optical scanning system and method using swath-area defect limitationADVANCED MICRO DEVICES INC·Filed 1997·Granted Jan 4, 2000·17 cites·9 claims
- 0853US5864199AElectron beam emitting tungsten filamentADVANCED MICRO DEVICES INC·Filed 1997·Granted Jan 26, 1999·9 cites·6 claims
- 0951US5727978AMethod of forming electron beam emitting tungsten filamentADVANCED MICRO DEVICES INC·Filed 1995·Granted Mar 17, 1998·8 cites·8 claims
- 1050US5713667ATemperature sensing probe for microthermometryADVANCED MICRO DEVICES INC·Filed 1995·Granted Feb 3, 1998·21 cites·12 claims
- 1145US6770512B1Method and system for using TMAH for staining copper silicon on insulator semiconductor device cross sectionsADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 3, 2004·4 cites·5 claims
- 1240US5646448ACopper pellet for reducing electromigration effects associated with a conductive via in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1996·Granted Jul 8, 1997·7 cites·16 claims
- 1331US6534869B2Method for reducing stress-induced voids for 0.25 μm micron and smaller semiconductor chip technology by annealing interconnect lines prior to ILD deposition and semiconductor chip made therebyADVANCED MICRO DEVICES INC·Filed 1998·Granted Mar 18, 2003·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →