Inventor · disambiguated record
Brian Via
Also filed as: VIA BRIAN
2 granted patents·1 pending application·2 citations·filing 2016–2023
35Inventor score
Files withUNIV AUBURN3
Top patents by PatentIndex Score
3 records- 0179US10266694B2Use of soy flour in resin formulations used to manufacture engineered wood compositesUNIV AUBURN·Filed 2016·Granted Apr 23, 2019·2 cites·10 claims
- 0265US2023340267A1Soy-substituted cold-set resinsUNIV AUBURN·Filed 2023·Application pending·0 cites
- 0345US10899039B2Soy-modified resins for bonding woodUNIV AUBURN·Filed 2017·Granted Jan 26, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →