Inventor · disambiguated record

Brandon P. Wirz

Also filed as: WIRZ BRANDON P

44 granted patents·18 pending applications·60 citations·filing 2012–2025

96Inventor score

Technology areasH10W H10P

Files withMICRON TECHNOLOGY INC59 GANDHI JASPREET S1 MICRONTECHNOLOGY INC1 SUN YANGYANG1

Top patents by PatentIndex Score

62 records

0196US11515171B2Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 29, 2022·4 cites·37 claims
0291US11715696B2Semiconductor devices with recessed pads for die stack interconnectionsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 1, 2023·3 cites·12 claims
0390US10923447B2Semiconductor device assembly with die support structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 16, 2021·5 cites·11 claims
0488US9299663B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 29, 2016·10 cites·17 claims
0587US2025364250A1Microelectronic devices and related methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
0686US10950568B2Semiconductor device assembly with surface-mount die support structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 16, 2021·4 cites·6 claims
0785US11911904B2Apparatus and methods for enhanced microelectronic device handlingMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 27, 2024·2 cites·31 claims
0885US11908828B2Contaminant control in thermocompression bonding of semiconductors and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 20, 2024·1 cites·6 claims
0985US11670612B2Method for solder bridging elimination for bulk solder C2S interconnectsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·1 cites·14 claims
1085US10276539B1Method for 3D ink jet TCB interconnect controlMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·7 cites·18 claims
1184US9362143B2Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packagesSUN YANGYANG·Filed 2012·Granted Jun 7, 2016·12 cites·26 claims
1281US12406847B2Microelectronic devices and related methods of fabricating microelectronic devicesMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 2, 2025·0 cites·17 claims
1381US2025079376A1Semiconductor device assembly with die support structuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
1480US12100661B2Semiconductor die edge protection for semiconductor device assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 24, 2024·0 cites·14 claims
1580US11289360B2Methods and apparatus for protection of dielectric films during microelectronic component processingMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 29, 2022·2 cites·24 claims
1680US10825761B2Electronic devices having tapered edge wallsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 3, 2020·2 cites·20 claims
1779US2024429191A1Semiconductor device assembly with surface-mount die support structuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
1879US2025015000A1Semiconductor die edge protection for semiconductor device assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
1977US12512332B2Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2024·Granted Dec 30, 2025·0 cites·16 claims
2076US12512368B2Thin die release for semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
2176US9741612B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 22, 2017·2 cites·13 claims
2275US12251841B2Apparatuses for handling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2024·Granted Mar 18, 2025·0 cites·20 claims
2375US12087697B2Semiconductor devices with recessed pads for die stack interconnectionsMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
2475US2024429172A1Semiconductor devices with recessed pads for die stack interconnectionsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
2573US11004828B2Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2019·Granted May 11, 2021·2 cites·29 claims
2672US9704781B2Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 11, 2017·3 cites·22 claims
2771US11961818B2Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 16, 2024·0 cites·19 claims
2871US11776908B2Semiconductor die edge protection for semiconductor device assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 3, 2023·0 cites·14 claims
2970US12148727B2Semiconductor device assembly with die support structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 19, 2024·0 cites·9 claims
3070US11784050B2Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatusMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 10, 2023·0 cites·28 claims
3170US2024006223A1Method for semiconductor die edge protection and semiconductor die separationMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
3268US12087720B2Semiconductor device assembly with surface-mount die support structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
3366US11705425B2Thermocompression bond tips and related apparatus and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·0 cites·18 claims
3465US11410961B2Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·26 claims
3564US11955345B2Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 9, 2024·0 cites·6 claims
3664US11764096B2Method for semiconductor die edge protection and semiconductor die separationMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 19, 2023·0 cites·13 claims
3763US2025132279A1Non-conductive film fillet control in semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
3860US11791212B2Thin die release for semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 17, 2023·0 cites·6 claims
3960US2025046730A1Apparatus with implanted alignment mark and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
4059US12506118B2Perpendicular semiconductor device assemblies and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
4159US10825762B2Methods of processing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 3, 2020·0 cites·21 claims
4259US2021111132A1Method for Substrate Moisture NCF Voiding EliminationMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
4356US10276479B1Methods of processing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·0 cites·19 claims
4456US2023317511A1Semiconductor assemblies with system and method for smoothing surfaces of 3d structuresMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
4554US11189609B2Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
4654US2024055366A1Spacer for chips on wafer semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
4753US11189590B2Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
4853US11024595B2Thermocompression bond tips and related apparatus and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 1, 2021·0 cites·19 claims
4953US2024038707A1Semiconductor device assembly interconnection pillars and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
5053US2023282607A1Methods and apparatus for stacked die warpage control during mass reflowMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites

Showing the top 50 of 62 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →