Inventor · disambiguated record
Buford H. Carter, Jr.
Also filed as: CARTER BUFORD H · CARTER JR BUFORD H
10 granted patents·1 pending application·602 citations·filing 1993–2002
92Inventor score
Files withTEXAS INSTRUMENTS INC10
Top patents by PatentIndex Score
11 records- 0197US6211462B1Low inductance power package for integrated circuitsTEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 3, 2001·279 cites·20 claims
- 0292US6365980B1Thermally enhanced semiconductor ball grid array device and method of fabricationTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·76 cites·22 claims
- 0383US5594234ADownset exposed die mount pad leadframe and packageTEXAS INSTRUMENTS INC·Filed 1994·Granted Jan 14, 1997·87 cites·12 claims
- 0479US6365976B1Integrated circuit device with depressions for receiving solder balls and method of fabricationTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·28 cites·9 claims
- 0571US5663597ARF device package for high frequency applicationsTEXAS INSTRUMENTS INC·Filed 1994·Granted Sep 2, 1997·45 cites·20 claims
- 0668US6401765B1Lead frame tooling design for exposed pad featuresTEXAS INSTRUMENTS INC·Filed 2000·Granted Jun 11, 2002·15 cites·1 claims
- 0764US5376909ADevice packagingTEXAS INSTRUMENTS INC·Filed 1993·Granted Dec 27, 1994·37 cites·20 claims
- 0856US6465274B2Lead frame tooling design for bleed barrier grooveTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 15, 2002·7 cites·5 claims
- 0955US6072230AExposed leadframe for semiconductor packages and bend forming method of fabricationTEXAS INSTRUMENTS INC·Filed 1997·Granted Jun 6, 2000·22 cites·15 claims
- 1037US5905308ABond pad for integrated circuitTEXAS INSTRUMENTS INC·Filed 1997·Granted May 18, 1999·6 cites·18 claims
- 1130US2003141103A1PCB solder pad geometry including patterns improving solder coverageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →