Inventor · disambiguated record
Bu-Chin Chung
Also filed as: CHUNG BU-CHIN
8 granted patents·5 pending applications·201 citations·filing 1992–2017
87Inventor score
Top patents by PatentIndex Score
13 records- 0179US5814564AEtch back method to planarize an interlayer having a critical HDP-CVD deposition processVANGUARD INT SEMICONDUCT CORP·Filed 1997·Granted Sep 29, 1998·71 cites·11 claims
- 0279US5587039APlasma etch equipmentVARIAN ASSOCIATES·Filed 1994·Granted Dec 24, 1996·59 cites·6 claims
- 0372US5837585AMethod of fabricating flash memory cellVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Nov 17, 1998·34 cites·11 claims
- 0470US9551569B2Apparatus and method for curvature and thin film stress measurementHERMES-EPITEK CORP·Filed 2014·Granted Jan 24, 2017·3 cites·15 claims
- 0566US9613875B2Method and system for manufacturing semiconductor epitaxy structureHERMES-EPITEK CORP·Filed 2016·Granted Apr 4, 2017·1 cites·8 claims
- 0663US9406536B1Method and system for manufacturing semiconductor epitaxy structureHERMES-EPITEK CORP·Filed 2015·Granted Aug 2, 2016·1 cites·10 claims
- 0763US5376223APlasma etch processVARIAN ASSOCIATES·Filed 1992·Granted Dec 27, 1994·31 cites·16 claims
- 0860US9617636B2System and method for controlling wafer and thin film surface temperatureHERMES-EPITEK CORP·Filed 2015·Granted Apr 11, 2017·1 cites·13 claims
- 0953US2015096496A1Vapor phase film deposition apparatusHERMES EPITEK CORP·Filed 2014·Application pending·0 cites
- 1045US2017117136A1Fabrication method of semiconductor multilayer structureHERMES-EPITEK CORP·Filed 2017·Application pending·0 cites
- 1144US2017314131A1Gas distributing injector applied in mocvd reactorHERMES-EPITEK CORP·Filed 2017·Application pending·0 cites
- 1241US2016293399A1Semiconductor multilayer structure and fabrication method thereofHERMES-EPITEK CORP·Filed 2015·Application pending·0 cites
- 1329US2016247886A1Semiconductor template and manufacturing method thereofHERMES-EPITEK CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →