Inventor · disambiguated record
Bum Sik Jang
Also filed as: JANG BUM SIK
7 granted patents·6 pending applications·67 citations·filing 2009–2014
83Inventor score
Top patents by PatentIndex Score
13 records- 0194US8017437B2Method for manufacturing a semiconductor packageSAMSUNG ELECTRO & MDASH MECHANICS CO LTD·Filed 2009·Granted Sep 13, 2011·45 cites·8 claims
- 0280US7875497B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·4 claims
- 0380US7875983B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·5 claims
- 0474US8575756B2Power package module with low and high power chips and method for fabricating the sameJANG BUM SIK·Filed 2011·Granted Nov 5, 2013·6 cites·28 claims
- 0568US8058722B2Power semiconductor module and method of manufacturing the sameGAO SHAN·Filed 2009·Granted Nov 15, 2011·4 cites·10 claims
- 0653US2010294543A1Heat dissipating substrate and method of manufacturing the sameSOHN YOUNG HO·Filed 2009·Application pending·0 cites
- 0752US2012273116A1Heat disspiating substrate and method of manufacturing the sameSOHN YOUNG HO·Filed 2012·Application pending·0 cites
- 0847US9161479B2Power module package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 13, 2015·0 cites·19 claims
- 0947US8309399B2Power semiconductor module and method of manufacturing the sameGAO SHAN·Filed 2011·Granted Nov 13, 2012·0 cites·10 claims
- 1047US2011031608A1Power device package and method of fabricating the sameKIM TAE HYUN·Filed 2009·Application pending·0 cites
- 1144US2010295172A1Power semiconductor moduleGAO SHAN·Filed 2009·Application pending·0 cites
- 1242US2015146382A1Package substrate, method of manufacturing the same, and power module package using package substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1332US2014027049A1Chip ejector and chip removal method using the sameJOO YONG HUI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →