Inventor · disambiguated record
Bubryong Lee
Also filed as: LEE BUBRYONG
2 granted patents·0 citations·filing 2018–2021
27Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0156US11776946B2Method of manufacturing package-on-package device and bonding apparatus used thereinSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·19 claims
- 0246US10998303B2Method of manufacturing package-on-package device and bonding apparatus used thereinSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 4, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →