Inventor · disambiguated record
Bumryul Maeng
Also filed as: MAENG BUMRYUL
0 granted patents·11 pending applications·0 citations·filing 2023–2025
Files withSTATS CHIPPAC PTE LTD11
Top patents by PatentIndex Score
11 records- 0158US2024387577A1Optical sensor package and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0257US2024387400A1Semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0357US2024421138A1Semiconductor package and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0452US2025336765A1Electronic package assembly with a cooling system and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0552US2024405049A1Sensor package and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0643US2025226288A1Semiconductor package assembly with an interlayer cooling pathwaySTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0741US2024363368A1Sensor package and method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0841US2024421172A1Two-way optical sensor package and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0941US2024096920A1Sensor assembly and method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1040US2024371812A1Electronic package and a packaging methodSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1138US2025228032A1Omnidirectional sensor package and a method for making the sameSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bumryul Maeng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →