Inventor · disambiguated record
Budi Njoman
Also filed as: NJOMAN BUDI
2 granted patents·8 citations·filing 2006–2006
47Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0170US7776648B2High thermal performance packaging for circuit diesAGERE SYSTEMS INC·Filed 2006·Granted Aug 17, 2010·8 cites·14 claims
- 0230US8859333B2Integrated circuit package and a method for dissipating heat in an integrated circuit packageCHUA KOK HUA SIMON·Filed 2006·Granted Oct 14, 2014·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →